DSPIC30F4013-20I/PT Microchip Technology Inc., DSPIC30F4013-20I/PT Datasheet - Page 187

• Manufacturer Part Number: DSPIC30F4013-20I/PT
• Description: 16 BIT MCU/DSP 44LD 20MIPS 48 KB FLASH
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC30F4013-20I/PT

• A/d Inputs: 13-Channels, 12-Bit
• Comparators: 4
• Cpu Speed: 30 MIPS
• Eeprom Memory: 1K Bytes
• Input Output: 30
• Interface: CAN, I2C/SPI/UART, USART
• Ios: 30
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 44-pin TQFP
• Programmable Memory: 48K Bytes
• Ram Size: 2K Bytes
• Timers: 5-16-bit, 2-32-bit
• Voltage, Range: 2.5-5.5
• Lead Free Status / Rohs Status: RoHS Compliant part

18-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
© 2006 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
E1
E
eB
Dimension Limits
2
1
§
D
c
dsPIC30F2011/2012/3012/3013
Units
A2
E1
B1
eB
A1
D
p
A
E
L
B
n
c
MIN
A1
A
.015
.300
.240
.890
.125
.008
.045
.014
.310
.140
.115
5
5
Note:
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
p
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
18
10
10
DS70139D-page 185
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15