DSPIC30F4013-20I/PT Microchip Technology Inc., DSPIC30F4013-20I/PT Datasheet - Page 188

• Manufacturer Part Number: DSPIC30F4013-20I/PT
• Description: 16 BIT MCU/DSP 44LD 20MIPS 48 KB FLASH
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC30F4013-20I/PT

• A/d Inputs: 13-Channels, 12-Bit
• Comparators: 4
• Cpu Speed: 30 MIPS
• Eeprom Memory: 1K Bytes
• Input Output: 30
• Interface: CAN, I2C/SPI/UART, USART
• Ios: 30
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 44-pin TQFP
• Programmable Memory: 48K Bytes
• Ram Size: 2K Bytes
• Timers: 5-16-bit, 2-32-bit
• Voltage, Range: 2.5-5.5
• Lead Free Status / Rohs Status: RoHS Compliant part

dsPIC30F2011/2012/3012/3013
18-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
DS70139D-page 186
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
B
c
p
n
45
Dimension Limits
E1
E
h
Units
A2
E1
A1
A
E
D
B
n
p
h
L
c
2
1
MIN
L
.093
.088
.004
.394
.446
.010
.016
.009
.014
D
.291
0
0
0
Note:
INCHES*
NOM
18
.050
.099
.008
.407
.295
.454
.020
.033
.017
.091
.011
A
12
12
A1
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
4
MAX
.104
.094
.012
.420
.299
.462
.029
.050
.012
.020
15
15
8
MIN
11.33
10.01
2.36
2.24
0.10
7.39
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
© 2006 Microchip Technology Inc.
NOM
18
10.34
11.53
1.27
2.50
0.20
7.49
0.50
0.84
0.27
0.42
2.31
12
12
4
MAX
10.67
11.73
A2
2.64
2.39
0.30
7.59
0.74
1.27
0.30
0.51
15
15
8