MT48LC16M8A2P-75L Micron Technology Inc, MT48LC16M8A2P-75L Datasheet - Page 73
![no-image](/images/manufacturer_photos/0/4/441/micron_technology_inc_sml.jpg)
MT48LC16M8A2P-75L
Manufacturer Part Number
MT48LC16M8A2P-75L
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC16M8A2P-75L.pdf
(74 pages)
Specifications of MT48LC16M8A2P-75L
Organization
16Mx8
Density
128Mb
Address Bus
14b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
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Figure 57:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. PRE-
REFLOW DIAMETER
IS 0.42 ON A 0.33 NSMD
BALL PAD.
16.00 ±0.10
60-Ball FBGA “FB/BB” Package (x8 device), 8mm x 16mm
60X Ø 0.45
8.00 ±0.05
Notes:
5.60
BALL
A8
1. All dimensions in millimeters.
2. Recommended pad size for PCB is 0.33mm ±0.025mm.
3. Topside part marking decoder can be found at http://www.micron.com/decoder.
0.155 ±0.013
0.850 ±0.05
2.40 ±0.05
8.00 ±0.10
2.80
0.80
TYP
CTR
5.60
4.00 ±0.05
C L
A
BALL A1
0.80
TYP
BALL #1 ID
11.20
73
SEATING PLANE
0.10 A
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
SOLDER BALL MATERIAL:
SUBSTRATE:
ENCAPSULATION MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn. 3% Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
128Mb: x4, x8, x16 SDRAM
Package Dimensions
©1999 Micron Technology, Inc. All rights reserved.
BALL #1 ID
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