MT47H128M16PK-25E IT:C Micron Technology Inc, MT47H128M16PK-25E IT:C Datasheet - Page 2

• Manufacturer Part Number: MT47H128M16PK-25E IT:C
• Manufacturer: Micron Technology Inc

Specifications of MT47H128M16PK-25E IT:C

• Lead Free Status / Rohs Status: Not Compliant

Table 1: Key Timing Parameters
Table 2: Addressing
Part Numbers
Figure 1: 2Gb DDR2 Part Numbers
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. E 06/10 EN
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
Note:
Speed Grade
-187E
-25E
-37E
-25
-3E
-5E
-3
1. Not all speeds and configurations are available.
Package
CL = 3
84-Ball 11.5mm x 14mm FBGA
60-Ball 11.5mm x 14mm FBGA
84-Ball 9.0mm x 12.5mm FBGA
60-Ball 9.0mm x 11.5mm FBGA
84-Ball 9.0mm x 12.5mm FBGA (lead solder)
400
400
400
400
n/a
n/a
n/a
64 Meg x 4 x 8 banks
Configuration
MT47H
128 Meg x 16
512 Meg x 4
256 Meg x 8
A[11, 9:0] (2K)
512 Meg x 4
A[14:0] (32K)
Example Part Number: MT47H256M8HG-25
BA[2:0] (8)
8K
128M16
512M4
256M8
Configuration
CL = 4
533
533
667
533
533
400
n/a
Data Rate (MHz)
Package
CL = 5
2
HG
HG
RT
EB
PK
667
800
667
667
667
n/a
n/a
32 Meg x 8 x 8 banks
-
256 Meg x 8
A[14:0] (32K)
-187E
Speed
-25E
-37E
A[9:0] (1K)
BA[2:0] (8)
-25
-3E
-5E
-3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Power
Standard
8K
t CK = 1.875ns, CL = 7
t CK = 2.5ns, CL = 5
t CK = 2.5ns, CL = 6
t CK = 3ns, CL = 4
t CK = 3ns, CL = 5
t CK = 3.75ns, CL = 4
t CK = 5ns, CL = 3
Speed Grade
CL = 6
IT
2Gb: x4, x8, x16 DDR2 SDRAM
800
800
800
n/a
n/a
n/a
n/a
Industrial Temperature
:A/:C
Revision
:
Blank
Revision
© 2006 Micron Technology, Inc. All rights reserved.
16 Meg x 16 x 8 banks
CL = 7
1066
n/a
n/a
n/a
n/a
n/a
n/a
128 Meg x 16
A[13:0] (16K)
BA[2:0] (8)
A[9:0] (1K)
8K
Features
t
RC (ns)
54
55
55
54
55
55
55