MT47H128M16PK-25E IT:C Micron Technology Inc, MT47H128M16PK-25E IT:C Datasheet - Page 21

• Manufacturer Part Number: MT47H128M16PK-25E IT:C
• Manufacturer: Micron Technology Inc

Specifications of MT47H128M16PK-25E IT:C

• Lead Free Status / Rohs Status: Not Compliant

Figure 10: 60-Ball FBGA Package (11.5mm x 14mm) – x4, x8
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. E 06/10 EN
Solder ball
material: SAC305.
Dimensions
apply to solder
balls post-reflow
on Ø0.33 NSMD
ball pads.
Seating
60X Ø0.45
plane
0.12 A
8 CTR
0.8 TYP
A
Notes:
9 8 7
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
0.8 TYP
11.5 ±0.15
6.4 CTR
3 2 1
A
B
C
D
E
F
G
H
J
K
L
0.8 ±0.1
21
Ball A1 ID
14 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
2Gb: x4, x8, x16 DDR2 SDRAM
1.2 MAX
Ball A1 ID
© 2006 Micron Technology, Inc. All rights reserved.
Packaging