MT47H128M16PK-25E IT:C Micron Technology Inc, MT47H128M16PK-25E IT:C Datasheet - Page 20

• Manufacturer Part Number: MT47H128M16PK-25E IT:C
• Manufacturer: Micron Technology Inc

Specifications of MT47H128M16PK-25E IT:C

• Lead Free Status / Rohs Status: Not Compliant

Figure 9: 84-Ball FBGA Package (9mm x 12.5mm) – x16
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. E 06/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD ball
pads.
Seating
11.2 CTR
plane
84X Ø0.45
0.12 A
0.8 TYP
Notes:
A
9 8 7
Nonconductive overmold
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
36%Pb, 2% Ag).
1.8 CTR
6.4 CTR
0.8 TYP
9 ±0.1
3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.8 ±0.05
20
12.5 ±0.1
Ball A1 ID
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2006 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging