STM32F101RDT6TR STMicroelectronics, STM32F101RDT6TR Datasheet - Page 11
![no-image](/images/manufacturer_photos/0/6/637/stmicroelectronics_sml.jpg)
STM32F101RDT6TR
Manufacturer Part Number
STM32F101RDT6TR
Description
16/32-BITS MICROS
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F101RET6.pdf
(106 pages)
Specifications of STM32F101RDT6TR
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F101RDT6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM32F101xC, STM32F101xD, STM32F101xE
2.1
Device overview
Table 2.
1. For the LQFP100 package, only FSMC Bank1 and Bank2 are available. Bank1 can only support a
Flash memory in Kbytes
SRAM in Kbytes
FSMC
Timers
Comm
GPIOs
12-bit ADC
Number of channels
12-bit DAC
Number of channels
CPU frequency
Operating voltage
Operating temperatures
Package
multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit
NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not
available in this package.
Peripherals
General-
purpose
Basic
SPI
I
USART
STM32F101xC, STM32F101xD and STM32F101xE features and peripheral
counts
2
C
256
32
STM32F101Rx
Doc ID 14610 Rev 7
LQFP64
384
No
51
16
Junction temperature: –40 to +105 °C (see
1
Ambient temperature: –40 to +85 °C (see
48
512
256
32
STM32F101Vx
2.0 to 3.6 V
LQFP100
36 MHz
Yes
384
80
16
4
2
3
2
5
1
1
2
(1)
48
512
256
32
Table
Table
STM32F101Zx
LQFP144
10)
10)
384
112
Yes
16
Description
1
48
11/106
512