RC48F4400P0TB0EA Micron Technology Inc, RC48F4400P0TB0EA Datasheet - Page 9
RC48F4400P0TB0EA
Manufacturer Part Number
RC48F4400P0TB0EA
Description
Manufacturer
Micron Technology Inc
Datasheet
1.RC48F4400P0TB0EA.pdf
(88 pages)
Specifications of RC48F4400P0TB0EA
Cell Type
NOR
Density
512Mb
Interface Type
Parallel/Serial
Boot Type
Bottom
Address Bus
25b
Operating Supply Voltage (typ)
2.5/3/3.3V
Operating Temp Range
-40C to 85C
Package Type
EZBGA
Sync/async
Async/Sync
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.3V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
32M
Supply Current
31mA
Mounting
Surface Mount
Pin Count
64
Lead Free Status / Rohs Status
Not Compliant
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P33-65nm
Table 2:
2.2
Figure 3:
Datasheet
9
Product Information
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
Notes:
1.
2.
3.
E
Ball A1
Corner
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
A2
C
D
E
G
H
A
B
F
TSOP Package Dimensions (Sheet 2 of 2)
Easy BGA Mechanical Specifications (256-Mbit, 512-Mbit)
64-Ball Easy BGA Package
1
Top View - Ball side down
A1
2
3
Symbol
N
Y
Z
θ
4
D
5
6
0.150
Min
0°
-
-
7
Millimeters
8
0.250
Nom
56
3°
-
A
A
G
B
C
D
E
F
H
0.100
0.350
Max
8
Seating
5°
Plane
-
Bottom View - Ball Side Up
7
6
0.006
Min
0°
-
-
5
Note: Drawing not to scale
4
Inches
0.010
Nom
3
56
3°
-
2
Order Number:320003-09
1
Y
0.004
0.014
Max
S1
5°
-
Ball A1
Corner
b
e
S2
Mar 2010
Note
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