M95256-WMN3TP/AB STMicroelectronics, M95256-WMN3TP/AB Datasheet - Page 38

• Manufacturer Part Number: M95256-WMN3TP/AB
• Manufacturer: STMicroelectronics

Package mechanical data
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Package mechanical data
In order to meet environmental requirements, ST offers the M95256 in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Figure 23. SO8N – 8 lead plastic small outline, 150 mils body width, package outline
1. Drawing is not to scale.
Table 22.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
A2
b
c
ccc
D
E
E1
e
h
k
L
L1
Symbol
SO8N – 8 lead plastic small outline, 150 mils body width, package data
4.900
6.000
3.900
1.270
1.040
A2
Typ
b
8
1
e
D
millimeters
Doc ID 12276 Rev 17
0.100
1.250
0.280
0.170
4.800
5.800
3.800
0.250
0.400
Min
0°
E1
A
E
ccc
1.750
0.250
0.480
0.230
0.100
5.000
6.200
4.000
0.500
1.270
Max
8°
M95256-DR, M95256, M95256-W, M95256-R
A1
0.1929
0.2362
0.1535
0.0500
0.0409
Typ
L1
L
GAUGE PLANE
h x 45˚
0.25 mm
c
inches
0.0039
0.0492
0.0110
0.0067
0.1890
0.2283
0.1496
0.0098
0.0157
Min
0°
k
SO-A
(1)
®
0.0689
0.0098
0.0189
0.0091
0.0039
0.1969
0.2441
0.1575
0.0197
0.0500
Max
8°