M95256-WMN3TP/AB STMicroelectronics, M95256-WMN3TP/AB Datasheet - Page 40

• Manufacturer Part Number: M95256-WMN3TP/AB
• Manufacturer: STMicroelectronics

Package mechanical data
40/47
Figure 25. UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is internally pulled to V
Table 24.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
D2 (rev MB)
D2 (rev MC)
E2 (rev MC)
E2 (rev MB)
K (rev MB)
K (rev MC)
Symbol
connected to any other voltage or signal line on the PCB, for example during the soldering process.
measuring.
eee
A1
L1
L3
A
D
E
b
e
L
(2)
outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
0.550
0.020
0.250
2.000
1.600
3.000
0.200
0.500
Typ
millimeters
Doc ID 12276 Rev 17
0.450
0.000
0.200
1.900
1.500
1.200
2.900
0.100
1.200
0.800
0.300
0.300
0.300
0.080
Min
1.700
0.300
0.600
0.050
0.300
2.100
1.600
3.100
1.600
0.500
0.150
Max
M95256-DR, M95256, M95256-W, M95256-R
0.0217
0.0008
0.0098
0.0787
0.0630
0.1181
0.0079
0.0197
Typ
inches
0.0177
0.0000
0.0079
0.0748
0.0591
0.0472
0.1142
0.0039
0.0472
0.0315
0.0118
0.0118
0.0118
0.0031
SS
Min
. It must not be
(1)
0.0236
0.0020
0.0118
0.0827
0.0669
0.0630
0.1220
0.0118
0.0630
0.0197
0.0059
Max