MCP23016-I/SP Microchip Technology, MCP23016-I/SP Datasheet - Page 19

IC I/O EXPANDER I2C 16B 28SDIP

MCP23016-I/SP

Manufacturer Part Number
MCP23016-I/SP
Description
IC I/O EXPANDER I2C 16B 28SDIP
Manufacturer
Microchip Technology
Datasheets

Specifications of MCP23016-I/SP

Package / Case
28-DIP (0.300", 7.62mm)
Interface
I²C
Number Of I /o
16
Interrupt Output
Yes
Frequency - Clock
400kHz
Voltage - Supply
2 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Includes
POR
Logic Family
MCP23016
Propagation Delay Time
50 ns
Operating Supply Voltage
2 V to 5.5 V
Power Dissipation
1 W
Operating Temperature Range
- 40 C to + 85 C
Input Voltage
4.5 V to 5.5 V
Logic Type
I/O Expander
Maximum Clock Frequency
400 KHz
Maximum Operating Frequency
3.4 MHz
Mounting Style
Through Hole
Output Current
25 mA
Output Voltage
4.5 V
Chip Configuration
16 Bit
Bus Frequency
400kHz
Ic Interface Type
I2C
No. Of I/o's
16
Supply Voltage Range
2V To 5.5V
Digital Ic Case Style
DIP
No. Of Pins
28
Ic Function
I/O Expander
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP23016-I/SP
Manufacturer:
AirBORN
Quantity:
214
2.0
Absolute Maximum Ratings †
Ambient temperature under bias................................................................................................................ -55 to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
Voltage on V
Total power dissipation (Note 1) ............................................................................................................................ 1.0 W
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin......................................................................................................... 25 mA
Maximum output current sourced by any I/O pin ................................................................................................... 25 mA
Maximum current sunk by combined PORTS ...................................................................................................... 200 mA
Maximum current sourced by combined PORTS ................................................................................................ 200 mA
© 2007 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows:
ELECTRICAL CHARACTERISTICS
Pdis = V
DD
with respect to V
DD
IK
OK
x {I
(V
DD
SS
I
(V
DD
< 0, or V
pin ............................................................................................................................. 250 mA
O
pin .......................................................................................................................... 300 mA
- ∑ I
< 0, or V
SS
OH
I
SS
......................................................................................................... -0.3V to +6.5V
> V
} + ∑ {(V
O
......................................................................................... -0.3V to (V
DD
> V
) ....................................................................................................... ± 20 mA
DD
DD
) ................................................................................................ ± 20 mA
-V
OH
) x I
OH
} + ∑(V
O
l x I
OL
)
MCP23016
DS20090C-page 19
DD
+ 0.3V)

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