MCP23016-I/SP Microchip Technology, MCP23016-I/SP Datasheet - Page 28

• Manufacturer Part Number: MCP23016-I/SP
• Description: IC I/O EXPANDER I2C 16B 28SDIP
• Manufacturer: Microchip Technology

Specifications of MCP23016-I/SP

• Package / Case: 28-DIP (0.300", 7.62mm)
• Interface: I²C
• Number Of I /o: 16
• Interrupt Output: Yes
• Frequency - Clock: 400kHz
• Voltage - Supply: 2 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Includes: POR
• Logic Family: MCP23016
• Propagation Delay Time: 50 ns
• Operating Supply Voltage: 2 V to 5.5 V
• Power Dissipation: 1 W
• Operating Temperature Range: - 40 C to + 85 C
• Input Voltage: 4.5 V to 5.5 V
• Logic Type: I/O Expander
• Maximum Clock Frequency: 400 KHz
• Maximum Operating Frequency: 3.4 MHz
• Mounting Style: Through Hole
• Output Current: 25 mA
• Output Voltage: 4.5 V
• Chip Configuration: 16 Bit
• Bus Frequency: 400kHz
• Ic Interface Type: I2C
• No. Of I/o's: 16
• Supply Voltage Range: 2V To 5.5V
• Digital Ic Case Style: DIP
• No. Of Pins: 28
• Ic Function: I/O Expander
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

MCP23016
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS20090C-page 28
NOTE 1
A1
Note:
A
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Units
eB
A2
A1
E1
b1
N
A
E
D
e
L
c
b
e
1.345
.120
.015
.290
.240
.110
.008
.040
.014
A2
MIN
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.310
.130
.050
.018
.135
.285
.010
28
–
–
–
© 2007 Microchip Technology Inc.
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
c