MCP23016-I/SP Microchip Technology, MCP23016-I/SP Datasheet - Page 31

• Manufacturer Part Number: MCP23016-I/SP
• Description: IC I/O EXPANDER I2C 16B 28SDIP
• Manufacturer: Microchip Technology

Specifications of MCP23016-I/SP

• Package / Case: 28-DIP (0.300", 7.62mm)
• Interface: I²C
• Number Of I /o: 16
• Interrupt Output: Yes
• Frequency - Clock: 400kHz
• Voltage - Supply: 2 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Includes: POR
• Logic Family: MCP23016
• Propagation Delay Time: 50 ns
• Operating Supply Voltage: 2 V to 5.5 V
• Power Dissipation: 1 W
• Operating Temperature Range: - 40 C to + 85 C
• Input Voltage: 4.5 V to 5.5 V
• Logic Type: I/O Expander
• Maximum Clock Frequency: 400 KHz
• Maximum Operating Frequency: 3.4 MHz
• Mounting Style: Through Hole
• Output Current: 25 mA
• Output Voltage: 4.5 V
• Chip Configuration: 16 Bit
• Bus Frequency: 400kHz
• Ic Interface Type: I2C
• No. Of I/o's: 16
• Supply Voltage Range: 2V To 5.5V
• Digital Ic Case Style: DIP
• No. Of Pins: 28
• Ic Function: I/O Expander
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

© 2007 Microchip Technology Inc.
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
A1
EXPOSED
E
A
NOTE 1
PAD
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
2
1
MIN
0.80
0.00
3.65
3.65
0.23
0.50
0.20
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.30
0.55
D2
28
–
Microchip Technology Drawing C04-105B
MCP23016
MAX
1.00
0.05
0.70
4.20
4.20
0.35
–
L
DS20090C-page 31
b
K
e