ADP5033ACBZ-1-R7 Analog Devices Inc, ADP5033ACBZ-1-R7 Datasheet - Page 23

• Manufacturer Part Number: ADP5033ACBZ-1-R7
• Description: IC REG QD SYNC BUCK/LDO1 16WLCSP
• Manufacturer: Analog Devices Inc
• Series: -r

Specifications of ADP5033ACBZ-1-R7

• Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (2)
• Function: Any Function
• Number Of Outputs: 4
• Frequency - Switching: 3MHz
• Voltage/current - Output 1: 0.8 V ~ 3.3 V, 800mA
• Voltage/current - Output 2: 0.8 V ~ 3.3 V, 800mA
• Voltage/current - Output 3: 0.8 V ~ 3.3 V, 300mA
• W/led Driver: No
• W/supervisor: No
• W/sequencer: No
• Voltage - Supply: 1.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-WFBGA, WLCSP
• No. Of Outputs: 4
• No. Of Pins: 16
• Operating Temperature Range: -40°C To +125°C
• Supply Voltage: 5.5V
• No. Of Step-down Dc - Dc Converters: 2
• No. Of Ldo Regulators: 2
• Digital Ic Case Style: WLCSP
• No. Of Regulated Outputs: 2
• Rohs Compliant: Yes
• Primary Input Voltage: 5.5V
• Output Voltage: 2.8V
• Output Current: 800mA
• Switching Frequency Max: 3MHz
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: ADP5033ACBZ-1-R7TR

PCB LAYOUT GUIDELINES
Poor layout can affect ADP5033 performance, causing electro-
magnetic interference (EMI) and electromagnetic compatibility
(EMC) problems, ground bounce, and voltage losses. Poor
layout can also affect regulation and stability. A good layout is
implemented using the following guidelines:
•
•
Place the inductor, input capacitor, and output capacitor
close to the IC using short tracks. These components carry
high switching frequencies, and large tracks act as antennas.
Route the output voltage path away from the inductor and
SW node to minimize noise and magnetic interference.
Rev. 0 | Page 23 of 28
•
•
•
Maximize the size of ground metal on the component side
to help with thermal dissipation.
Use a ground plane with several vias connecting to the
component side ground to further reduce noise interfer-
ence on sensitive circuit nodes.
Connect VIN1 and VIN2 together close to the IC using
short tracks.
ADP5033