ADP5033ACBZ-1-R7 Analog Devices Inc, ADP5033ACBZ-1-R7 Datasheet - Page 6

• Manufacturer Part Number: ADP5033ACBZ-1-R7
• Description: IC REG QD SYNC BUCK/LDO1 16WLCSP
• Manufacturer: Analog Devices Inc
• Series: -r

Specifications of ADP5033ACBZ-1-R7

• Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (2)
• Function: Any Function
• Number Of Outputs: 4
• Frequency - Switching: 3MHz
• Voltage/current - Output 1: 0.8 V ~ 3.3 V, 800mA
• Voltage/current - Output 2: 0.8 V ~ 3.3 V, 800mA
• Voltage/current - Output 3: 0.8 V ~ 3.3 V, 300mA
• W/led Driver: No
• W/supervisor: No
• W/sequencer: No
• Voltage - Supply: 1.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-WFBGA, WLCSP
• No. Of Outputs: 4
• No. Of Pins: 16
• Operating Temperature Range: -40°C To +125°C
• Supply Voltage: 5.5V
• No. Of Step-down Dc - Dc Converters: 2
• No. Of Ldo Regulators: 2
• Digital Ic Case Style: WLCSP
• No. Of Regulated Outputs: 2
• Rohs Compliant: Yes
• Primary Input Voltage: 5.5V
• Output Voltage: 2.8V
• Output Current: 800mA
• Switching Frequency Max: 3MHz
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: ADP5033ACBZ-1-R7TR

ADP5033
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
VIN1, VIN2, VIN3, VIN4, VOUT1, VOUT2,
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
ESD Human Body Model
ESD Charged Device Model
ESD Machine Model
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
For detailed information on power dissipation, see the Power
Dissipation and Thermal Considerations section.
VOUT3, VOUT4, ENA, MODE, ENB to
Ground
Rating
–0.3 V to +6 V
–65°C to +150°C
–40°C to +125°C
JEDEC J-STD-020
±1500 V
±500 V
±100 V
Rev. 0 | Page 6 of 28
THERMAL RESISTANCE
θ
device soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
16-Ball, 0.5 mm Pitch WLCSP
ESD CAUTION
JA
and Ψ
JB
are specified for the worst-case conditions, that is, a
θ
57
JA
Ψ
14
JB
Unit
°C/W