A2F200M3F-FGG484 Actel, A2F200M3F-FGG484 Datasheet - Page 6
A2F200M3F-FGG484
Manufacturer Part Number
A2F200M3F-FGG484
Description
ACLA2F200M3F-FGG484 SMART FUSION MIX SIG
Manufacturer
Actel
Datasheet
1.A2F500M3B-1CSH484.pdf
(170 pages)
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
A2F200M3F-FGG484
Manufacturer:
ACTEL
Quantity:
6 800
Company:
Part Number:
A2F200M3F-FGG484
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
A2F200M3F-FGG484
Manufacturer:
ACTEL/爱特
Quantity:
20 000
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Product Ordering Codes
Note:
Temperature Grade Offerings
SmartFusion Devices
CS288
FG256
FG484
Notes:
1. C = Commercial Temperature Range: 0°C to 85°C Junction
2. I = Industrial Temperature Range: –40°C to 100°C Junction
A2F200
Actel’s SmartFusion Intelligent Mixed Signal FPGAs
V I
*Most devices in the SmartFusion family can be ordered with the Y suffix. Devices with a package size greater or equal to 5x5
mm are supported. Contact your local Actel sales representative for more information.
Part Number
SmartFusion Devices
A2F060 =
A2F200 =
A2F500 =
M3
CPU Type
M3 = Cortex-M3
60,000 System Gates
200,000 System Gates
500,000 System Gates
F
eNVM Size
_
A = 8 Kbytes
B = 16 Kbytes
C = 32 Kbytes
D = 64 Kbytes
E = 128 Kbytes
F = 256 Kbytes
G = 512 Kbytes
1
Blank
Speed Grade
–1 = 100 MHz MSS Speed; FPGA Fabric 15% Faster than Standard
= 80 MHz MSS Speed; FPGA Fabric at Standard Speed
FG
Package Type
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
CS = Chip Scale Package (0.5 mm pitch)
A2F060
G
C, I
–
–
Lead-Free Packaging Options
R ev i si o n 3
Blank = Standard Packaging
484
G = RoHS-Compliant (green) Packaging
H = Halogen-Free Packaging
Package Lead Count
256
288
484
Y
Security Feature*
Y = Device Includes License to Implement IP Based on the
A2F200
Cryptograhpy Research, Inc. (CRI) Patent Portfolio
I
C, I
C, I
C, I
Application (junction temperature range)
Blank = Commercial (0 to +85°C)
ES = Engineering Silicon (room temperature only)
I = Industrial (–40 to +100°C)
A2F500
C, I
C, I
C, I
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