TD62706P Toshiba, TD62706P Datasheet
![no-image](/images/manufacturer_photos/0/6/668/toshiba_sml.jpg)
TD62706P
Specifications of TD62706P
Available stocks
Related parts for TD62706P
TD62706P Summary of contents
Page 1
... TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62705P,TD62705F,TD62706P,TD62706F 6CH HIGH−VOLTAGE SOURCE DRIVER The TD62705P, TD62705F and TD62706P, TD62706F are comprised of six source current transistor array. These drivers are specifically designed for fluorescent display applications. For proper operation, the substrate (SUB) must be connected to the most negative voltage ...
Page 2
... Note 2: Delated above 25°C in the proportion 8 °C (P Type), 5 °C (F Type). RECOMMENDED OPERATING CONDITIONS CHARACTERISTIC TD62705P TD62705F Supply Voltage TD62706P TD62706F Output Voltage Output Current TD62705P TD62705F Input Voltage TD62706P TD62706F P Power Dissipation F Note: On Glass Epoxy PCB (50 × 50 × 1.6 mm, Cu 50%) (Ta = 25°C) SYMBOL RATING UNIT V − V ...
Page 3
... TD62706P TD62706F TD62705P TD62705F "H" Level Input TD62706P Current TD62706F "L" Level Output Leakage Current Collector−Emitter Saturation Voltage TD62705P TD62705F Supply Current (Output On) TD62706P TD62706F Turn−On Delay Turn−Off Delay Ta = 25°C) TEST CIR− SYMBOL TEST CONDITION CUIT ...
Page 4
... Utmost care is necessary in the design of the output line, V destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding (sat) INPUT CONDITION TYPE NAME V IN TD62705P, TD62705F 0−9V TD62706P, TD62706F 0− Pulse Width 50 µs IN Duty Cycle 50% t ≤ ≤ and GND (SUB, V ...
Page 5
TD62705,706P/F 5 2006-07-11 ...
Page 6
PACKAGE DIMENSIONS DIP16−P−300−2.54A Weight: 1.11 g (Typ.) TD62705,706P/F 6 Unit: mm 2006-07-11 ...
Page 7
PACKAGE DIMENSIONS SOP16−P−225−1.27 Weight: 0.16 g (Typ.) TD62705,706P/F 7 Unit: mm 2006-07-11 ...
Page 8
Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and ...
Page 9
Points to remember on handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...
Page 10
... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property ...