PCF8574P NXP Semiconductors, PCF8574P Datasheet - Page 17
PCF8574P
Manufacturer Part Number
PCF8574P
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8574P.pdf
(24 pages)
Specifications of PCF8574P
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Package Type
PDIP
Rad Hardened
No
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCF8574P
Manufacturer:
TI
Quantity:
1 870
Part Number:
PCF8574P
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
PCF8574P,112
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
PCF8574P-3
Manufacturer:
AFATECH
Quantity:
16 725
Part Number:
PCF8574PW
Manufacturer:
TI/德州仪器
Quantity:
20 000
Company:
Part Number:
PCF8574PWR
Manufacturer:
LT
Quantity:
7 600
Part Number:
PCF8574PWR
Manufacturer:
TI/德州仪器
Quantity:
20 000
Philips Semiconductors
12 PACKAGE OUTLINES
2002 Nov 22
DIP16: plastic dual in-line package; 16 leads (300 mil)
Remote 8-bit I/O expander for I
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
OUTLINE
VERSION
SOT38-4
max.
0.17
4.2
A
L
0.020
min.
0.51
A
Z
1
1
16
pin 1 index
max.
0.13
A
3.2
IEC
2
0.068
0.051
1.73
1.30
b
e
0.021
0.015
0.53
0.38
b
1
JEDEC
D
0.049
0.033
1.25
0.85
b
REFERENCES
2
0
2
C-bus
b
0.014
0.009
0.36
0.23
c
scale
19.50
18.55
EIAJ
D
0.77
0.73
17
5
(1)
9
8
b
1
6.48
6.20
0.26
0.24
E
(1)
A
b
1
2
w
A
E
10 mm
2.54
0.10
M
2
e
A
7.62
0.30
e
1
3.60
3.05
0.14
0.12
c
L
PROJECTION
EUROPEAN
(e )
M
M
8.25
7.80
0.32
0.31
M
1
H
E
E
10.0
0.39
0.33
Product specification
M
8.3
H
PCF8574
ISSUE DATE
0.254
0.01
92-11-17
95-01-14
w
SOT38-4
0.030
max.
0.76
Z
(1)