PCF8574P NXP Semiconductors, PCF8574P Datasheet - Page 2
PCF8574P
Manufacturer Part Number
PCF8574P
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8574P.pdf
(24 pages)
Specifications of PCF8574P
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Package Type
PDIP
Rad Hardened
No
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCF8574P
Manufacturer:
TI
Quantity:
1 870
Part Number:
PCF8574P
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
PCF8574P,112
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
PCF8574P-3
Manufacturer:
AFATECH
Quantity:
16 725
Part Number:
PCF8574PW
Manufacturer:
TI/德州仪器
Quantity:
20 000
Company:
Part Number:
PCF8574PWR
Manufacturer:
LT
Quantity:
7 600
Part Number:
PCF8574PWR
Manufacturer:
TI/德州仪器
Quantity:
20 000
Philips Semiconductors
CONTENTS
1
2
3
4
5
5.1
5.2
6
6.1
6.2
6.3
6.4
7
7.1
7.2
7.3
8
9
10
11
12
13
13.1
13.2
13.2.1
13.2.2
13.3
13.3.1
13.3.2
13.3.3
13.4
14
15
16
17
2002 Nov 22
Remote 8-bit I/O expander for I
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
DIP16 and SO16 packages
SSOP20 package
CHARACTERISTICS OF THE I
Bit transfer
Start and stop conditions
System configuration
Acknowledge
FUNCTIONAL DESCRIPTION
Addressing
Interrupt output
Quasi-bidirectional I/Os
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
I
PACKAGE OUTLINES
SOLDERING
Introduction
Through-hole mount packages
Soldering by dipping or by solder wave
Manual soldering
Surface mount packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of IC packages for wave, reflow and
dipping soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C-BUS TIMING CHARACTERISTICS
2
C COMPONENTS
2
C-BUS
2
C-bus
2
Product specification
PCF8574