PCF8576DT NXP Semiconductors, PCF8576DT Datasheet - Page 37

• Manufacturer Part Number: PCF8576DT
• Manufacturer: NXP Semiconductors

Specifications of PCF8576DT

• Operating Supply Voltage (typ): 2.5/3.3/5V
• Number Of Digits: 20
• Number Of Segments: 160
• Package Type: TSSOP
• Pin Count: 56
• Mounting: Surface Mount
• Power Dissipation: 400mW
• Frequency (max): 400KHz
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (max): 5.5V
• Lead Free Status / Rohs Status: Supplier Unconfirmed

NXP Semiconductors
14. Bare die outline
Fig 26. Bare die outline PCF8576DU/DA/2
PCF8576D_9
Product data sheet
Wire bond die; 59 bonding pads; 2.26 x 2.01 x 0.38 mm
Dimensions
Notes
1. Pad size
2. Passivation opening
3. Dimension not drawn to scale
4. Marking code: PC8576D-2
PCF8576DU/DA
mm
Unit
version
Outline
max
nom
min
36
51
(4)
0.38
A
C2
2.26
D
52
35
IEC
2.01
E
0.072
e
(3)
P
0.09
1
(1)
JEDEC
59 1
x
P
0.08 0.066
0
2
(2)
0
D
y
0
References
P
Rev. 09 — 25 August 2009
3
(1)
0.056
P
4
22
(2)
JEITA
scale
0.5
8
Universal LCD driver for low multiplex rates
C1
1 mm
21
9
X
e
E
European
projection
P
P
2
1
detail X
PCF8576D
A
© NXP B.V. 2009. All rights reserved.
P
4
PCF8576DU/DA
pcf8576du_da_do
Issue date
08-10-20
08-12-10
P
3
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