LH28F320BFHE-PTTL60 Sharp Electronics, LH28F320BFHE-PTTL60 Datasheet - Page 4

• Manufacturer Part Number: LH28F320BFHE-PTTL60
• Manufacturer: Sharp Electronics

Specifications of LH28F320BFHE-PTTL60

• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 60ns
• Interface Type: Parallel
• Boot Type: Top
• Address Bus: 21b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 11.7 to 12.3V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 2M
• Supply Current: 25mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Compliant

sharp
48-Lead TSOP Pinout................................................. 3
Pin Descriptions.......................................................... 4
Simultaneous Operation Modes
Memory Map .............................................................. 6
Identifier Codes and OTP Address
Identifier Codes and OTP Address for
OTP Block Address Map for OTP Program............... 8
Bus Operation............................................................. 9
Command Definitions .............................................. 10
Functions of Block Lock and Block Lock-Down..... 12
Block Locking State Transitions upon
Block Locking State Transitions upon
Status Register Definition......................................... 14
Allowed with Four Planes .................................. 5
for Read Operation ............................................. 7
Read Operation on Partition Configuration........ 7
Command Write................................................ 12
WP#/ACC Transition ....................................... 13
PAGE
CONTENTS
LHF32FB2
Extended Status Register Definition ......................... 15
Partition Configuration Register Definition.............. 16
Partition Configuration ............................................. 16
1 Electrical Specifications......................................... 17
2 Related Document Information.............................. 29
3 Package and packing specification ........................ 30
1.1 Absolute Maximum Ratings ........................... 17
1.2 Operating Conditions ...................................... 17
1.2.1 Capacitance .............................................. 18
1.2.2 AC Input/Output Test Conditions ............ 18
1.2.3 DC Characteristics ................................... 19
1.2.4 AC Characteristics
1.2.5 AC Characteristics
1.2.6 Reset Operations ...................................... 27
1.2.7 Block Erase, Full Chip Erase,
- Read-Only Operations......................... 21
- Write Operations ................................. 25
(Page Buffer) Program and
OTP Program Performance.................... 28
Rev. 2.44
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