S29GL032M10TAIR10 AMD (ADVANCED MICRO DEVICES), S29GL032M10TAIR10 Datasheet - Page 22

• Manufacturer Part Number: S29GL032M10TAIR10
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of S29GL032M10TAIR10

• Lead Free Status / Rohs Status: Not Compliant

Ordering Information: S29GL128M
Notes:
1.
2.
3.
4.
5.
6.
7.
20
This product has been retired and is not recommended for designs. For new and current designs, S29GL128P supersedes S29GL128M, and is the
factory-recommended migration path. Please refer to the S29GL-P Datasheet for specifications and ordering information.
S29GL128M
Base Ordering
Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
This package is recommended for new designs using TSOPs.
TSOP package marking omits packing type designator from the ordering part number.
BGA package marking omits leading “S29” and packing type designator from the ordering part number.
100% Matte Sn is used for Pb-free TSOP plating.
SnBi is used for Pb-free TSOP plating.
Contact your Spansion representative for availability of the 90ns speed option for LAA064.
Part Number
S29GL128M
DEVICE NUMBER/DESCRIPTION
S29GL128M
128 Megabit Page-Mode Flash Memory Manufactured using 0.23 µm MirrorBit™
Process Technology, 3.0 Volt-only Read, Program, and Erase
Standard products are available in several packages and operating ranges. The order number
(Valid Combination) is formed by a combination of the following:
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
90
90, 10, 11
(Note
Option
Speed
T
7)
A
S29GL128M Valid Combinations
Package Type, Material,
& Temperature Range
I
Table 3. S29GL128M Ordering Options
TAI, TDI
TAI, TFI
FAI, FFI
R1
S29GL-M MirrorBit
0
Valid Combinations
PACKING TYPE
0
2
3
Model Number
R1
R2
R8
R9
TEMPERATURE RANGE
I
PACKAGE MATERIAL SET
A
F
D
PACKAGE TYPE
T
F
SPEED OPTION
See Product Selector Guide and Valid Combinations
D a t a
= Tray
= 7” Tape and Reel
= 13” Tape and Reel
= x8/x16, V
= x8/x16, V
= x8/x16, V
= x8/x16, V
= Industrial (–40
= Standard
= Pb-Free
= Pb-Free
= Thin Small Outline Package (TSOP) Standard Pinout
= Fortified Ball-Grid Array Package
Number
sector protected when WP#/ACC=V
protected when WP#/ACC=V
sector protected when WP#/ACC=V
protected when WP#/ACC=V
R1, R2
R1, R2
Model
TM
R9
Flash Family
S h e e t
CC
CC
CC
CC
=3.0-3.6V, Uniform sector device, lowest address sector
=3.0-3.6V, Uniform sector device, lowest address sector
=3.0-3.6V, Uniform sector device, highest address
=3.0-3.6V, Uniform sector device, highest address
0, 2, 3
°
C to +85
Packing
Type
(Note
°
C)
1)
IL
IL
, FPT-56P-M01 package only
TS056 (2, 3, 5)
FPT-56P-M01 (3, 6)
LAA064 (4)
IL
IL
, FPT-56P-M01 package only
Package Descriptions
S29GL-M_00_B8 February 7, 2007
(Notes)
Fortified-BGA
TSOP