XPC850ZT50B Freescale Semiconductor, XPC850ZT50B Datasheet - Page 71

• Manufacturer Part Number: XPC850ZT50B
• Manufacturer: Freescale Semiconductor

Specifications of XPC850ZT50B

• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 50MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Supply Voltage (max): 3.465V
• Operating Supply Voltage (min): 3.135V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: BGA
• Lead Free Status / Rohs Status: Not Compliant

Pin Assignments and Mechanical Dimensions of the PBGA
Figure 9-65 shows the JEDEC package dimensions of the PBGA.
71
Figure 9-65. Package Dimensions for the Plastic Ball Grid Array (PBGA)—JEDEC
C
A1
A
SIDE VIEW
256X
SEATING
PLANE
A2
A3
0.35 C
0.20 C
4X
(E1)
0.20
4X
Freescale Semiconductor, Inc.
15X
MPC850 (Rev. A/B/C) Hardware Specifications
E
e /2
B
For More Information On This Product,
A
e
E2
BOTTOM VIEW
2
Go to: www.freescale.com
3
4
5
CASE 1130-01
6
Standard
7
TOP VIEW
ISSUE B
8 9 10 11 12 13 14 15 16
(D1)
D2
15X
D
256X
e
0.30
0.15
b
M
M
17
C A B
C
M
G
U
T
R
P
N
L
K
J
H
F
E
D
C
B
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO PRIMARY
DATUM C.
PRIMARY DATUM C AND THE SEATING PLANE ARE
DEFINED BY THE SPHERICAL CROWNS OF THE
SOLDER BALLS.
DIM
A1
A2
A3
D1
D2
E1
E2
A
D
E
b
e
19.00
19.00
MILLIMETERS
MIN
1.91
0.50
1.12
0.29
0.60
23.00 BSC
19.05 REF
23.00 BSC
19.05 REF
1.27 BSC
20.00
20.00
MAX
2.35
0.70
1.22
0.43
0.90
MOTOROLA