XPC850ZT50B Freescale Semiconductor, XPC850ZT50B Datasheet - Page 9
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XPC850ZT50B
Manufacturer Part Number
XPC850ZT50B
Description
Manufacturer
Freescale Semiconductor
Datasheet
1.XPC850ZT50B.pdf
(76 pages)
Specifications of XPC850ZT50B
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
50MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Supply Voltage (max)
3.465V
Operating Supply Voltage (min)
3.135V
Operating Temp Range
0C to 95C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
256
Package Type
BGA
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XPC850ZT50B
Manufacturer:
SHARP
Quantity:
686
Part Number:
XPC850ZT50B
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Part Number:
XPC850ZT50B-0K24A
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Part Number:
XPC850ZT50BU
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Part IV Thermal Characteristics
Table 4-3 shows the thermal characteristics for the MPC850.
Table 4-4 provides power dissipation information.
Table 4-5 provides the DC electrical characteristics for the MPC850.
MOTOROLA
Operating voltage at 40 MHz or less
Operating voltage at 40 MHz or higher
Input high voltage (address bus, data bus, EXTAL, EXTCLK,
and all bus control/status signals)
Input high voltage (all general purpose I/O and peripheral pins)
1
2
3
4
temperature rise of 13 ° C above ambient.
T
P
Thermal resistance for BGA
Thermal Resistance for BGA (junction-to-case)
J
I/O
Assumes natural convection and a single layer board (no thermal vias).
Assumes natural convection, a multilayer board with thermal vias
For more information on the design of thermal vias on multilayer boards and BGA layout considerations in
general, refer to AN-1231/D,
office.
Assumes natural convection, a multilayer board with thermal vias
temperature rise of 20° C above ambient.
= T
P
where:
D
is the power dissipation on pins
A
= (V
+ (P
DD
1
2
D
Power Dissipation
All Revisions
(1:1) Mode
•
Typical power dissipation is measured at 3.3V
Maximum power dissipation is measured at 3.65 V
•
I
θ
DD
JA
Characteristic
) + P
)
Characteristic
Characteristic
I/O
Freescale Semiconductor, Inc.
Table 4-5. DC Electrical Specifications
MPC850 (Rev. A/B/C) Hardware Specifications
1
For More Information On This Product,
Table 4-3. Thermal Characteristics
Table 4-4. Power Dissipation (P
Frequency (MHz)
Go to: www.freescale.com
33
40
50
KAPWR, VDDSYN
KAPWR, VDDSYN
Typical
Symbol
TBD
TBD
TBD
VDDH, VDDL,
VDDH, VDDL,
θ
θ
θ
θ
JA
JA
JA
JC
Symbol
4
4
, 1 watt MPC850 dissipation, and a board
VIH
VIH
, 1 watt MPC850 dissipation, and a board
1
available from your local Motorola sales
Maximum
D
)
515
590
725
Value
40
24
31
8
2
4
3
3.135
2
Min
3.0
2.0
2.0
Unit
mW
mW
mW
3.465
Max
3.6
3.6
° C/W
° C/W
° C/W
° C/W
5.5
Unit
Unit
V
V
V
V
9