N28F001BXT150 Intel, N28F001BXT150 Datasheet

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N28F001BXT150

Manufacturer Part Number
N28F001BXT150
Description
Manufacturer
Intel
Datasheet

Specifications of N28F001BXT150

Density
1Mb
Access Time (max)
150ns
Interface Type
Parallel
Boot Type
Top
Address Bus
17b
Operating Supply Voltage (typ)
5V
Operating Temp Range
0C to 70C
Package Type
PLCC
Program/erase Volt (typ)
11.4 to 12.6V
Sync/async
Asynchronous
Operating Temperature Classification
Commercial
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Word Size
8b
Number Of Words
128K
Supply Current
30mA
Mounting
Surface Mount
Pin Count
32
Lead Free Status / Rohs Status
Not Compliant

Available stocks

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Price
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N28F001BXT150
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Part Number:
N28F001BXT150
Manufacturer:
INT
Quantity:
3 000
Part Number:
N28F001BXT150
Manufacturer:
INTEL
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5 510
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The Intel
features that simplify write and allow block erase. These devices aid the system designer by combining the
functions of several components into one, making boot block flash an innovative alternative to EPROM and
EEPROM or battery-backed static RAM. Many new and existing designs can take advantage of the
28F001BX’s integration of blocked architecture, automated electrical reprogramming, and standard processor
interface.
The 28F001BX-B and 28F001BX-T are 1,048,576 bit nonvolatile memories organized as 131,072 bytes of
eight bits. They are offered in 32-pin plastic DIP and 32-lead PLCC packages. Pin assignment conform to
JEDEC standards for byte-wide EPROMs. These devices use an integrated command port and state
machine for simplified block erasure and byte reprogramming. The 28F001BX-T’s block locations provide
compatibility with microprocessors and microcontrollers that boot from high memory, such as Intel
186 family, 80286, i386™, i486™, i860™ and 80960CA. With exactly the same memory segmentation, the
28F001BX-B memory map is tailored for microprocessors and microcontrollers that boot from low memory,
such as Intel’s MCS-51, MCS-196, 80960KX and 80960SX families. All other features are identical, and
unless otherwise noted, the term 28F001BX can refer to either device throughout the remainder of this
document.
The boot block section includes a reprogramming write lock out feature to guarantee data integrity. It is
designed to contain secure code which will bring up the system minimally and download code to the other
locations of the 28F001BX. Intel 28F001BX employs advanced CMOS circuitry for systems requiring high-
performance access speeds, low-power consumption, and immunity to noise. Its access time provides zero
wait-state performance for a wide range of microprocessors and microcontrollers. A deep power-down mode
lowers power consumption to 0.25 µW typical through V
instrumentation and other low-power applications. The RP# power control input also provides absolute data
protection during system power-up or power loss.
Manufactured on Intel
experience to yield the highest levels of quality, reliability, and cost-effectiveness.
Note: This document formerly known as 1-Mbit (128K x 8) Boot Block Flash Memory .
December 1998
High-Integration Blocked Architecture
Simplified Program and Erase
SRAM-Compatible Write Interface
Deep Power-Down Mode
12.0 V ±5% V
One 8 KB Boot Block w/Lock Out
Two 4 KB Parameter Blocks
One 112 KB Main Block
Automated Algorithms via On-Chip
Write State Machine (WSM)
0.05 µA I
0.8 µA I
®
28F001BX-B and 28F001BX-T combine the cost-effectiveness of Intel standard flash memory with
PP
5 VOLT BOOT BLOCK FLASH MEMORY
CC
PP
Typical
Typical
®
(until publication date)
INTEL CONFIDENTIAL
ETOX™ process technology base, the 28F001BX builds on years of EPROM
28F001BX (x8)
n
n
n
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High-Performance Read
Hardware Data Protection Feature
Advanced Packaging, JEDEC Pinouts
ETOX™ II Nonvolatile Flash
Technology
CC
120 ns, 150 ns Maximum Access
Time
5.0 V ±10% V
Erase/Write Lockout during Power
Transitions
32-Pin PDIP
32-Lead PLCC
EPROM-Compatible Process Base
High-Volume Manufacturing
Experience
—crucial in laptop computer, hand-held
CC
Order Number: 290406-009
®
MCS®-

Related parts for N28F001BXT150

N28F001BXT150 Summary of contents

Page 1

... Intel’s MCS-51, MCS-196, 80960KX and 80960SX families. All other features are identical, and unless otherwise noted, the term 28F001BX can refer to either device throughout the remainder of this document ...

Page 2

... Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. ...

Page 3

... Programming Equipment .................... 13 3.5.2 In-System Programming ..................... 13 3.6 Write .......................................................... 13 4.0 COMMAND DEFINITIONS............................ 13 4.1 Read Array Command ............................... 13 4.2 Intelligent Identifier Command for In-System Programming ............................................ 14 4.3 Read Status Register Command ............... 15 4.4 Clear Status Register Command ............... 15 4.5 Erase Setup/Erase Confirm Commands .... 15 4.6 Erase Suspend/Erase Resume Commands15 4 ...

Page 4

REVISION HISTORY Number -004 Removed Preliminary classification. Latched address A in Figure 5. 16 Updated Boot Block Program and Erase section: “If boot block program or erase is attempted while RP ‘1,’ reflective of the ...

Page 5

... The Intel ® 28F001BX Flash Boot Block memory augments the nonvolatility, in-system electrical erasure and reprogrammability of Intel’s flash memory by offering four separately erasable blocks and integrating a state machine to control erase and program functions. The specialized blocking architecture and automated programming ...

Page 6

Figure 1. 28F001BX Block Diagram 6 29040601 ...

Page 7

Table 1. Lead Descriptions Symbol Type A 0 –A 16 INPUT ADDRESS INPUTS for memory addresses. Addresses are internally latched during a write cycle –DQ 7 INPUT/ DATA INPUTS/OUTPUTS: Inputs data and commands during memory write OUTPUT cycles; ...

Page 8

...

Page 9

Figure 3. PLCC Lead Congfiguration 28F001BX 29040604 9 ...

Page 10

... Write cycles also internally latch addresses and data needed for programming or erase operations. appropriate command written to the register, standard microprocessor read timings output array data, access the intelligent identifier codes, or output program and erase status for verification. 29040606 pin enables successful altering memory ...

Page 11

... Erase Confirm commands, the state machine controls block pre-conditioning and erase, returning progress via the status register. Programming is similarly controlled, after destination address and expected data are supplied. The program algorithm of past Intel Flash memories is now regulated by the state machine, including ...

Page 12

... Read The 28F001BX has three read modes. The memory can be read from any of its blocks, and information can be read from the intelligent identifier or the status register. V can be at either PPL The first task is to write the appropriate Read Mode ...

Page 13

... V to read the intelligent PP identifiers from the command register. 3.6 Write Writes to the command register allow read of device data and intelligent identifiers. They also control inspection and clearing of the status register. Additionally, when PPH register controls device erasure and programming. ...

Page 14

... IID = Data read from intelligent identifiers. 4. Following the Intelligent Identifier command, two read operations access manufacture and device codes. 5. Commands other than those shown above are reserved by Intel for future device implementations and should not be used. 14 4.2 Intelligent Identifier Command for In-System Programming ...

Page 15

Read Status Register Command The 28F001BX contains a status register which may be read to determine when a program or erase operation is complete, and whether that operation completed successfully. The status register may be read at any time ...

Page 16

At this point, a Read Array command can be written to the command register to read data from blocks other than that which is suspended. The only other valid commands at this time are Read Status Register (70H) and ...

Page 17

... Block erasure or < a repeat of byte programming will initialize this data PPL to a known value. 7.0 ON-CHIP ERASE ALGORITHM As above, the quick-erase algorithm of prior Intel Flash memory devices internally, including all preconditioning of block data. WSM operation, erase success and V voltage presence are monitored and reported through the status register ...

Page 18

The entire sequence is performed with V PP Abort occurs when RP# transitions to V falls while erase is in progress. Block data PPL is partially erased by this operation, and a repeat of erase is ...

Page 19

Start Write 40H, Byte Address Write Byte Address/Data Read Status Register No SR Yes Full Status Check if Desired Byte Program Completed FULL STATUS CHECK PROCEDURE Read Status Register Data (See Above Range ...

Page 20

Start Write 20H, Block Address Write D0H, Block Address Read Status Register No No Suspend SR Erase? Yes Full Status Check if Desired Block Erase Completed FULL STATUS CHECK PROCEDURE Read Status Register Data (See Above) No ...

Page 21

Start Write B0H Write 70H Read Status Register 0 SR SR.6 = Erase Resumed 1 Write FFH Read Array Data No Done Reading Yes Write D0H Write FFH Read Array Data Erase Resumed Figure 10. 28F001BX Erase ...

Page 22

... DESIGN CONSIDERATIONS Flash memories are often used in larger memory arrays. Intel provides three control inputs to accommodate multiple memory connections. Three- line control provides for: a) lowest possible memory power dissipation b) complete assurance that data bus contention will not occur To efficiently use these control inputs, an address decoder should enable CE#, while OE# should be connected to all memory devices and the system’ ...

Page 23

... When designing portable systems, designers must consider battery power consumption not only during device operation, but also for data retention during system idle time. Flash nonvolatility increases usable battery life because the 28F001BX does not consume any power to retain code or data when the system is off ...

Page 24

ELECTRICAL SPECIFICATIONS 10.1 Absolute Maximum Ratings* Operating Temperature During Read................................. 0 ° °C During Erase/Program.................. 0 ° °C Operating Temperature During Read ........................... –40 °C to +85 °C During Erase/Program............ –40 °C to +85 ...

Page 25

... PPE Erase Suspend Current PPES Intelligent Identifier Current Input Low Voltage IL V Input High Voltage IH V Output Low Voltage OL V Output High Voltage Intelligent Identifier Voltage ID 9 Notes Min Typ Max Unit Test Conditions 1 ±1.0 µ ±10 µ OUT 1.2 2.0 ...

Page 26

DC Characteristics (Continued) Symbol Parameter V V during Normal Operations PPL during Prog/Erase Operations PPH Erase/Write Lock Voltage LKO CC V RP#, OE# Unlock Voltage HH NOTES: 1. All currents are in ...

Page 27

... Intelligent Identifier Current Input Low Voltage IL V Input High Voltage IH V Output Low Voltage OL V Output High Voltage (TTL) OH1 V Output High Voltage (CMOS) OH2 V A Intelligent Identifier Voltage during Normal Operations PPL during Prog/Erase PPH PP Operations V V Erase/Write Lock Voltage LKO CC V ...

Page 28

Input 0.8 0.45 AC test inputs are driven for a Logic "1" and V OH TTL (2 and V (0 Output timing ends at V TTL IL TTL ...

Page 29

AC Characteristics—Read-Only Operations Version (2)a Symbol Parameter t t Read Cycle Time AVAV Address to Output Delay AVQV ACC t t CE# to Output Delay ELQV RP# High to Output Delay PHQV PWH ...

Page 30

Figure 14. AC Waveform for Read Operations 30 29040612 ...

Page 31

AC Characteristics—Write/Erase/Program Operations Versions Symbol Parameter t t Write Cycle Time AVAV RP# High Recovery to WE# Going Low PHWL CE# Setup to WE# Going Low ELWL WE# Pulse Width ...

Page 32

... Refer to Table 3 for valid D for byte programming or block erasure The on-chip WSM incorporates all program and erase system functions and overhead of standard Intel Flash memory, including byte program and verify (programming) and block precondition, precondition verify, erase and erase verify (erasing). 6. ...

Page 33

Figure 15. 28F001BX Typical Programming Capability Figure 16. 28F001BX Typical Programming Time 29040619 Figure 17. 28F001BX Typical Erase Capability 29040620 Figure 18. 28F001BX Typical Erase Time 28F001BX 29040621 29040622 33 ...

Page 34

Figure 19. AC Waveform for Write Operations 34 29040613 ...

Page 35

Figure 20. Alternate Boot Block Access Method Using OE# 28F001BX 29040615 35 ...

Page 36

AC Characteristics—CE#-Controlled Write Operations Versions V CC Symbol Parameter t t Write Cycle Time AVAV RP# High Recovery to CE# Going PHEL PS Low t t WE# Setup to CE# Going Low WLEL WS t ...

Page 37

NOTES: 1. Chip-enable controlled writes: write operations are driven by the valid combination of CE# and WE#. In systems where CE# defines the write pulse width (within a longer WE# timing waveform), all set-up, hold and inactive WE# times should ...

Page 38

Figure 21. Alternate AC Waveform for Write Operations 38 29040616 ...

Page 39

... AP-623 Multi-Site Layout Planning Using Intel’s Boot Block Flash Memory NOTE: 1. Please call the Intel Literature Center at (800) 548-4725 to request Intel documentation. International customers should contact their local Intel or distribution sales office. 2. Visit Intel’s World Wide Web home page at http://www.intel.com for technical documentation and tools. ...

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