PUMB2 NXP Semiconductors, PUMB2 Datasheet - Page 3

PUMB2

Manufacturer Part Number
PUMB2
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PUMB2

Transistor Polarity
PNP
Collector-emitter Voltage
50V
Dc Current Gain (min)
80
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
6
Package Type
SOT-363
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PUMB20
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
PUMB2Ј¬115
Manufacturer:
NXP
Quantity:
30 000
NXP Semiconductors
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
2. Reflow soldering is the only recommended soldering method.
2003 Oct 15
PEMB2
PUMB2
Per transistor
V
V
V
V
I
I
P
T
T
T
Per device
P
SYMBOL
O
CM
TYPE NUMBER
stg
j
amb
CBO
CEO
EBO
I
tot
tot
PNP/PNP resistor-equipped transistors;
R1 = 47 kΩ, R2 = 47 kΩ
collector-base voltage
collector-emitter voltage
emitter-base voltage
input voltage
output current (DC)
peak collector current
total power dissipation
storage temperature
junction temperature
operating ambient temperature
total power dissipation
positive
negative
SOT363
SOT666
SOT363
SOT666
PARAMETER
NAME
plastic surface mounted package; 6 leads
plastic surface mounted package; 6 leads
open emitter
open base
open collector
T
note 1
notes 1 and 2
T
note 1
notes 1 and 2
amb
amb
≤ 25 °C
≤ 25 °C
3
CONDITIONS
DESCRIPTION
PACKAGE
−65
−65
MIN.
PEMB2; PUMB2
−50
−50
−5
+10
−40
−100
−100
200
200
+150
150
+150
300
300
MAX.
Product data sheet
VERSION
SOT666
SOT363
V
V
V
V
V
mA
mA
mW
mW
°C
°C
°C
mW
mW
UNIT

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