TD62308AF Toshiba, TD62308AF Datasheet

no-image

TD62308AF

Manufacturer Part Number
TD62308AF
Description
Manufacturer
Toshiba
Datasheet

Specifications of TD62308AF

Polarity
NPN/PNP
Number Of Elements
4
Collector-emitter Voltage
50V
Collector Current (dc) (max)
1.5A
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
18
Package Type
HSOP
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TD62308AF
Manufacturer:
TOSH
Quantity:
1 000
Part Number:
TD62308AF
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Part Number:
TD62308AF(EL)
Manufacturer:
TOSHIBA
Quantity:
1 000
Part Number:
TD62308AF(EL)
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Part Number:
TD62308AFG
Manufacturer:
TOSHIBA
Quantity:
1 770
Part Number:
TD62308AFG
Manufacturer:
TOSHIBA
Quantity:
20 000
Company:
Part Number:
TD62308AFG
Quantity:
129
Part Number:
TD62308AFG(5
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Part Number:
TD62308AFG(5,S,EL)
Manufacturer:
TOSHIBA
Quantity:
1 000
Part Number:
TD62308AFG��5��S��EL��
Quantity:
1 000
4ch Low Input Active High-Current Darlington Sink Driver
is comprised of four NPN darlington output stages and PNP
input stages.
operation with 5-V TTL, 5-V CMOS and 5-V Microprocessor
which have sink current output drivers.
motor drivers.
Features
Pin Assignment (top view)
The TD62308AP/AF is a non−inverting transistor array which
This device is low−level input active driver and is suitable for
Application include relay, hammer, lamp and stepping
High sustaining voltage output: 50 V (min)
Output clamp diodes
Output current (single output): 1.5 A (max)
Input compatible with TTL and 5 V CMOS
Low level active inputs
Standard supply voltage
Two V
GND and SUB terminal = Heat sink
Package type-AP: DIP-16 pin
Package type-AF: HSOP-16 pin
TD62308AP
TD62308AF
V
COM
V
COM
CC1
CC1
16
16
1
1
CC
terminals V
O4
O1
15
2
O4
O1
15
2
14
I4
I1
TD62308AP,TD62308AF
3
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
14
I4
I1
3
CC1
NC
NC
13
4
, V
13
CC2
4
Heat sink
Heat sink
Heat sink
Heat sink
& GND
& GND
& GND
& GND
(separated)
12
5
NC
NC
12
5
11
I3
I2
6
11
I3
I2
6
O3
O2
10
7
O3
O2
10
7
1
V
V
COM
COM
CC2
CC2
9
8
9
8
Weight
DIP16-P-300-2.54A: 1.11 g (typ.)
HSOP16-P-300-1.00: 0.50 g (typ.)
TD62308AP
TD62308AF
TD62308AP/AF
2006-06-14

Related parts for TD62308AF

TD62308AF Summary of contents

Page 1

... Pin Assignment (top view) TD62308AP Heat sink & GND COM CC1 Heat sink & GND TD62308AF Heat sink & GND COM Heat sink CC1 & GND TD62308AP TD62308AF Weight DIP16-P-300-2.54A: 1.11 g (typ.) HSOP16-P-300-1.00: 0.50 g (typ COM CC2 COM CC2 1 TD62308AP/AF 2006-06-14 ...

Page 2

... If a TD62308AP/AF is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba recommends that the diodes (pins 9 and 16) be connected to the secondary power supply pin absorb the counter electromotive force generated by the load. Please adhere to the device’s absolute maximum ratings. ...

Page 3

Recommended Operating Conditions Characteristics Supply voltage Output sustaining voltage AP Output current AF Output ON Input voltage Output OFF Clamp diode reverse voltage Clamp diode forward current AP Power dissipation AF Note 1: On glass epoxy PCB (50 × 50 ...

Page 4

Test Circuit 1. I CEX CEX Open Open OFF Input V Open V CC OUT R Pulse generator C V (Note ...

Page 5

V – V OUT 25°C (typ.) I OUT = 0 5 4 (V) Input voltage IN I – V (sat) OUT CE 1.5 ...

Page 6

... I – Duty cycle OUT 1500 1200 900 600 TD62308AF 300 Ta = 25° 5 Duty Cycle (%) I – Duty cycle OUT 1500 1200 900 600 TD62308AF 300 Ta = 85° 5 100 Duty Cycle (%) 6 TD62308AP/ 100 2006-06-14 ...

Page 7

Package Dimensions Weight: 1.11 g (typ.) TD62308AP/AF 7 2006-06-14 ...

Page 8

Package Dimensions Weight: 0.50 g (typ.) TD62308AP/AF 8 2006-06-14 ...

Page 9

Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...

Page 10

Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...

Page 11

... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property ...

Related keywords