TD62308AF Toshiba, TD62308AF Datasheet
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TD62308AF
Specifications of TD62308AF
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TD62308AF Summary of contents
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... Pin Assignment (top view) TD62308AP Heat sink & GND COM CC1 Heat sink & GND TD62308AF Heat sink & GND COM Heat sink CC1 & GND TD62308AP TD62308AF Weight DIP16-P-300-2.54A: 1.11 g (typ.) HSOP16-P-300-1.00: 0.50 g (typ COM CC2 COM CC2 1 TD62308AP/AF 2006-06-14 ...
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... If a TD62308AP/AF is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba recommends that the diodes (pins 9 and 16) be connected to the secondary power supply pin absorb the counter electromotive force generated by the load. Please adhere to the device’s absolute maximum ratings. ...
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Recommended Operating Conditions Characteristics Supply voltage Output sustaining voltage AP Output current AF Output ON Input voltage Output OFF Clamp diode reverse voltage Clamp diode forward current AP Power dissipation AF Note 1: On glass epoxy PCB (50 × 50 ...
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Test Circuit 1. I CEX CEX Open Open OFF Input V Open V CC OUT R Pulse generator C V (Note ...
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V – V OUT 25°C (typ.) I OUT = 0 5 4 (V) Input voltage IN I – V (sat) OUT CE 1.5 ...
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... I – Duty cycle OUT 1500 1200 900 600 TD62308AF 300 Ta = 25° 5 Duty Cycle (%) I – Duty cycle OUT 1500 1200 900 600 TD62308AF 300 Ta = 85° 5 100 Duty Cycle (%) 6 TD62308AP/ 100 2006-06-14 ...
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Package Dimensions Weight: 1.11 g (typ.) TD62308AP/AF 7 2006-06-14 ...
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Package Dimensions Weight: 0.50 g (typ.) TD62308AP/AF 8 2006-06-14 ...
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Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...
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Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...
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... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property ...