LPC1765FET100,551 NXP Semiconductors, LPC1765FET100,551 Datasheet - Page 43

• Manufacturer Part Number: LPC1765FET100,551
• Description: IC MCU 32BIT 256KB FLSH 100TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1765FET100,551

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFBGA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-7565; LPC1765FET100,551

NXP Semiconductors
9. Thermal characteristics
Table 6.
V
LPC1769_68_67_66_65_64_63
Product data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
•
•
•
j
−
=
T
R
P
40
amb
D
T
th(j-a)
amb
°
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (°C),
+
= the package junction-to-ambient thermal resistance (°C/W)
(
P
D
All information provided in this document is subject to legal disclaimers.
°
Conditions
×
C unless otherwise specified;
R
th j a
(
–
Rev. 7 — 5 April 2011
)
)
LPC1769/68/67/66/65/64/63
j
(°C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
Max
125
© NXP B.V. 2011. All rights reserved.
Unit
°C
43 of 79
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