PIC18F4585-H/P Microchip Technology, PIC18F4585-H/P Datasheet - Page 460

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PIC18F4585-H/P

Manufacturer Part Number
PIC18F4585-H/P
Description
IC MCU 8BIT 48KB FLASH 40PDIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheet

Specifications of PIC18F4585-H/P

Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 150°C
Package / Case
40-DIP (0.600", 15.24mm)
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC18F2585/2680/4585/4680
DS39625C-page 458
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
Preliminary
φ
E1
Units
D1
L
A2
A1
L1
E1
N
A
E
D
e
L
φ
c
b
α
β
NOTE 2
E
A1
A
0.95
0.05
0.45
0.09
0.30
MIN
11°
11°
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
Microchip Technology Drawing C04-076B
© 2007 Microchip Technology Inc.
α
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13°
13°
A2

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