PXAH30KFBE,557 NXP Semiconductors, PXAH30KFBE,557 Datasheet - Page 27

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PXAH30KFBE,557

Manufacturer Part Number
PXAH30KFBE,557
Description
IC XA MCU 16BIT CMOS 100LQFP
Manufacturer
NXP Semiconductors
Series
XAr
Datasheet

Specifications of PXAH30KFBE,557

Core Processor
XA
Core Size
16-Bit
Speed
30MHz
Connectivity
EBI/EMI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
33
Program Memory Size
-
Program Memory Type
ROMless
Eeprom Size
-
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
-
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PXAH30KFBE,557
Manufacturer:
NXP Semiconductors
Quantity:
10 000
1. V
2. Ports in quasi-bidirectional mode with weak pullup.
3. Ports in PUSH-PULL mode, both pullup and pulldown assumed to be the same strength.
4. In all output modes.
5. Port pins source a transition current when used in quasi-bidirectional mode and externally driven from 1 to 0. This current is highest when
6. Measured with port in high impedance mode.
7. Measured with port in quasi-bidirectional mode.
8. Under steady state (non-transient) conditions, IOL must be externally limited as follows:
Philips Semiconductors
ABSOLUTE MAXIMUM RATINGS
PRELIMINARY DC ELECTRICAL CHARACTERISTICS
V
NOTE:
1999 Sep 24
Operating temperature under bias
Storage temperature range
Voltage on any other pin to V
Maximum I
Power dissipation (based on package heat transfer, not device power consumption)
DD
Symbol
Symbol
CMOS 16-bit highly integrated microcontroller
V
If I
test conditions.
V
V
V
V
V
= 5.0 V +/– 10% or 3.3 V +/– 10% unless otherwise specified; T
I
I
V
C
DD
IN
V
RAM
I
I
PDI
OH1
OH2
I
I
DD
TL
OL
ID
IH1
OL
IL
LI
IH
IL
IO
is approximately 2 V.
must be raised to within the operating range before power down mode is exited.
exceeds the test condition, V
OL
Power supply current, operating
Power supply current, Idle mode
Power supply current, Power Down mode
RAM keep-alive voltage
Input low voltage
Input high voltage, except Xtal1, RST
Input high voltage to Xtal1, RST
Output low voltage all ports
Output high voltage, all ports
Output high voltage, all ports
Input/Output pin capacitance
Logical 0 input current, all ports
Input leakage current, all ports
Logical 1 to 0 transition current, all ports
per I/O pin
Maximum I
Maximum I
Maximum total I
SS
Parameter
Parameter
OL
OL
per port pin:
per 8-bit port:
OL
OL
may exceed the related specification. Pins are not guaranteed to sink current greater than the listed
8
Parameter
for all outputs:
6
7
5
1
I
OH
I
I
I
I
I
15 mA (NOTE: This is +85 C specification for V
26 mA
71 mA
OH
OH
OH
OL
OL
For both 3.0 & 5.0 V
= –100 A, V
amb
= 3.2 mA, V
= 1.0 mA, V
= –30 A, V
= 3.2 mA, V
= 1.0 mA, V
Test Conditions
Test Conditions
V
At V
At V
5.0 V, 30 MHz
3.3 V, 30 MHz
5.0 V, 30 MHz
3.3 V, 30 MHz
27
V
IN
5.0 V, 3.0 V
= –40 C to +85 C for industrial, unless otherwise specified.
IN
= V
DD
DD
= 0.45 V
IL
= 5.5 V
= 3.6 V
or V
DD
DD
DD
DD
DD
DD
= 4.5 V
= 3.0 V
= 3.0 V
= 4.5 V
= 3.0 V
IH
= 4.5 V
0.7 V
–0.5
Min
1.5
2.2
2.4
2.0
2.4
2.2
–0.5 to V
DD
–55 to +125
–65 to +150
Rating
1.5
15
DD
Limits
+0.5 V
DD
Typ
64
55
50
44
= 5 V)
Preliminary specification
0.22 V
–650
–250
Max
500
–50
0.5
0.4
80
70
70
60
15
10
XA-H3
DD
Unit
mA
W
v
C
C
Unit
Unit
mA
mA
mA
mA
pF
V
V
V
V
V
V
V
V
V
V
A
A
A
A
A

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