B300D44A102XXG ON Semiconductor, B300D44A102XXG Datasheet - Page 8

• Manufacturer Part Number: B300D44A102XXG
• Description: IC PROCESSOR AUDIO 24BIT 44DFN
• Manufacturer: ON Semiconductor
• Series: BelaSigna® 300r
• Type: Audio Processorr

Specifications of B300D44A102XXG

• Applications: Portable Equipment
• Mounting Type: Surface Mount
• Package / Case: 44-VFDFN
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: B300D44A102XXG; B300D44A102XXGOSTR

WLCSP Assembly / Design Notes
ON Semiconductor recommends solder−on−pad (SoP)
surface finish. With SoP, the solder mask opening should be
non−solder mask−defined (NSMD) and copper pad
geometry will be dictated by the PCB vendor’s design
requirements.
of screened solder paste (#5) should be less than
0.0008 mm
then following conditions must be met:
WLCSP Weight
DFN Pin Out
Table 8. DFN PAD DESCRIPTIONS
For PCB manufacture with BelaSigna 300 WLCSP,
Alternative surface finishes are ENiG and OSP; volume
BelaSigna 300 WLCSP (B300W35A102XYG) has an average weight of 0.095 grams.
A total of 44 active pins are present on the BelaSigna 300 DFN package. A description of these pins is given in Table 8.
Pad Index
15,22
16,21
20
19
18
17
13
14
12
10
44
43
42
41
40
34
33
39
38
11
9
8
2
5
7
6
4
3
1
3
. If no pre−screening of solder paste is used,
GNDRCVR
VBATRCVR
RCVR_HP+
RCVR+
RCVR−
RCVR_HP−
CAP0
CAP1
VDBL
VBAT
VREG
AGND0
AGND1
AIR01
AIR23
AI4
AI3/LOUT3
AI2/LOUT2
AI1/LOUT1
AI0/LOUT0
GPIO[4]/LSAD[4]
GPIO[3]/LSAD[3]
GPIO[2]/LSAD[2]
GPIO[1]/LSAD[1]/UART−RX
GPIO[0]/UART−TX
GNDC
VDDC
GNDO
VDDO
BelaSigna 300 Pad Name
Ground for output driver
Power supply for output stage
Extra output driver pad for high power mode
Output from output driver
Output from output driver
Extra output driver pad for high power mode
Charge pump capacitor pin 0
Charge pump capacitor pin 1
Doubled voltage
Power supply
Regulated supply voltage
Analog ground 0
Analog ground 1
Input stage reference for channels 0 and 1
Input stage reference for channels 2 and 3
Audio signal input 4
Audio signal input 3/output signal from preamp 3
Audio signal input 2/output signal from preamp 2
Audio signal input 1/output signal from preamp 1
Audio signal input 0/output signal from preamp 0
General−purpose I/O 4/low speed AD input 4
General−purpose I/O 3/low speed AD input 3
General−purpose I/O 2/low speed AD input 2
General−purpose I/O 1/low speed AD input 1/and UART RX
General−purpose I/O 0/UART TX
Core logic ground
Core logic power
Digital ground
Digital power
http://onsemi.com
8
land pattern CAD files to assist your PCB design upon
request.
ON Semiconductor can provide BelaSigna 300 WLCSP
1. the solder mask opening should be >0.3 mm in
2. the copper pad will have 0.25 mm diameter, and
3. soldermask thickness should be less than 1 mil
Description
diameter,
thick above the copper surface.
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
O
O
O
O
O
O
I
I
I
I
A/D
A/D
A/D
A/D
A/D
A/D
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A