DS3170+ Maxim Integrated Products, DS3170+ Datasheet - Page 202
![IC TXRX DS3/E3 100-CSBGA](/photos/6/94/69414/100-csbga_21-0153b_sml.jpg)
DS3170+
Manufacturer Part Number
DS3170+
Description
IC TXRX DS3/E3 100-CSBGA
Manufacturer
Maxim Integrated Products
Datasheet
1.DS3170.pdf
(230 pages)
Specifications of DS3170+
Function
Single-Chip Transceiver
Interface
DS3, E3
Number Of Circuits
1
Voltage - Supply
3.135 V ~ 3.465 V
Current - Supply
120mA
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
100-LBGA
Includes
DS3 Framers, E3 Framers, HDLC Controller, On-Chip BERTs
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
- Current page: 202 of 230
- Download datasheet (3Mb)
13 JTAG INFORMATION
13.1 JTAG Description
This device supports the standard instruction codes SAMPLE/PRELOAD, BYPASS, and EXTEST. Optional public
instructions included are HIGHZ, CLAMP, and IDCODE. The device contains the following items, which meet the
requirements set by the IEEE 1149.1 Standard Test Access Port (TAP) and Boundary Scan Architecture:
The Test Access Port has the necessary interface pins, namely JTCLK, JTDI, JTDO, and JTMS, and the optional
JTRST input. Details on these pins can be found in Section 8. Refer to IEEE 1149.1-1990, IEEE 1149.1a-1993, and
IEEE 1149.1b-1994 for details about the Boundary Scan Architecture and the Test Access Port.
Figure 13-1. JTAG Block Diagram
Test Access Port (TAP)
TAP Controller
Instruction Register
Bypass Register
Boundary Scan Register
Device Identification Register
10K
JTDI
10K
JTMS
Register
Register
Bypass
Register
Register
Instruction
Controller
Identification
Boundary Scan
Test Access Port
JTCLK
202 of 230
10K
JTRST
Select
Tri-State
Mux
DS3170 DS3/E3 Single-Chip Transceiver
JTDO
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