SC16C550BIB48,128 NXP Semiconductors, SC16C550BIB48,128 Datasheet - Page 44

• Manufacturer Part Number: SC16C550BIB48,128
• Description: IC UART SINGLE W/FIFO 48-LQFP
• Manufacturer: NXP Semiconductors

Specifications of SC16C550BIB48,128

• Number Of Channels: 1, UART
• Package / Case: 48-LQFP
• Features: Programmable
• Fifo's: 16 Byte
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Data Rate: 3 Mbps
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.25 V
• Supply Current: 4.5 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 2.5 V or 3.3 V or 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935274388128; SC16C550BIB48-F; SC16C550BIB48-F

NXP Semiconductors
13. Soldering of through-hole mount packages
SC16C550B_5
Product data sheet
13.1 Introduction to soldering through-hole mount packages
13.2 Soldering by dipping or by solder wave
13.3 Manual soldering
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Fig 28. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Rev. 05 — 1 October 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
5 V, 3.3 V and 2.5 V UART with 16-byte FIFOs
temperature
SC16C550B
peak
stg(max)
© NXP B.V. 2008. All rights reserved.
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