SC16C654DIB64,151 NXP Semiconductors, SC16C654DIB64,151 Datasheet - Page 50
![IC UART QUAD W/FIFO 64-LQFP](/photos/6/98/69856/568-64-lqfp_sot314-2_sml.jpg)
SC16C654DIB64,151
Manufacturer Part Number
SC16C654DIB64,151
Description
IC UART QUAD W/FIFO 64-LQFP
Manufacturer
NXP Semiconductors
Datasheet
1.SC16C654DIB64151.pdf
(52 pages)
Specifications of SC16C654DIB64,151
Number Of Channels
4, QUART
Fifo's
64 Byte
Voltage - Supply
2.5V, 3.3V, 5V
With Auto Flow Control
Yes
With Irda Encoder/decoder
Yes
With False Start Bit Detection
Yes
With Modem Control
Yes
With Cmos
Yes
Mounting Type
Surface Mount
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-3281
935270050151
SC16C654DIB64-S
935270050151
SC16C654DIB64-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SC16C654DIB64,151
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Philips Semiconductors
13. Revision history
Table 30:
9397 750 11617
Product data
Rev Date
04
03
02
01
20030619
20030415
20030313
20020910
Revision history
CPCN
-
-
-
-
Description
Product data (9397 750 11617); ECN 853-2377 30029 of 16 June 2003.
Modifications:
Product data (9397 750 11373); ECN 853-2377 29798 of 11 April 2003.
Product data (9397 750 10985); ECN 853-2377 29458 of 03 February 2003.
Product data (9397 750 09393); ECN 853-2377 28891 of 10 September 2002.
[3]
[4]
[5]
[6]
[7]
•
•
•
Figure 6 “Crystal oscillator connection.” on page
connection with resistor.
Table 27 “DC electrical characteristics” on page
Table 28 “AC electrical
strobe width’, and re-number subsequent note.
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Quad UART with 64-byte FIFO and infrared (IrDA) encoder/decoder
Rev. 04 — 19 June 2003
characteristics”: add
Table note
34: I
16: changed capacitors’ values and added
10 C measured in the atmosphere of the reflow
CCsleep
SC16C654/654D
2, its reference to parameter ‘IOW
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
: change all values to 1 mA nom.
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