MT29F8G08AAAWP-ET:ATR Micron Technology Inc, MT29F8G08AAAWP-ET:ATR Datasheet - Page 18

no-image

MT29F8G08AAAWP-ET:ATR

Manufacturer Part Number
MT29F8G08AAAWP-ET:ATR
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT29F8G08AAAWP-ET:ATR

Cell Type
NAND
Density
8Gb
Access Time (max)
18ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
30b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP-I
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
1G
Supply Current
30mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Compliant
Minimum Rp
Figure 12:
Figure 13:
PDF: 09005aef818a56a7 / Source: 09005aef81590bdd
2gb_nand_m29b__2.fm - Rev. I 1/06 EN
READY/BUSY# Open Drain
t
R and
Notes: 1.
t
F
V
Rp (MIN, 3.3V part) =
Where ΣIL is the sum of the input currents of all devices tied to the R/B# pin.
2.
3.
4.
5. See TC values in Figure 15 on page 19 for approximate Rp value and TC.
GND
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
V
CC
t
t
impedance.
t
t
R and
R dependent on external capacitance and resistive loading and output transistor
R primarily dependent on external pull-up resistor and external capacitive loading.
F ≈ 10ns at 3.3V.
-1
I
OL
t
F calculated at 10 percent and 90 percent points.
0
Device
2
V
CC
R/B#
Open drain output
t
F
2, 4, 8Gb: x8/x16 Multiplexed NAND Flash Memory
(MAX) – V
4
Rp
I
t
OL
TC
R
+ ΣI
0
18
OL
L
(MAX)
2
Micron Technology, Inc., reserves the right to change products or specifications without notice.
=
4
8mA + ΣI
3.2V
6
L
©2004 Micron Technology, Inc. All rights reserved.
Bus Operation

Related parts for MT29F8G08AAAWP-ET:ATR