TDA8932BT/N2,112 NXP Semiconductors, TDA8932BT/N2,112 Datasheet - Page 16

• Manufacturer Part Number: TDA8932BT/N2,112
• Description: IC AMP AUDIO 55W STER D 32SOIC
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TDA8932BT/N2,112

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Package / Case: 32-SOIC (7.5mm Width)
• Max Output Power X Channels @ Load: 55W x 1 @ 8 Ohm; 26.5W x 2 @ 4 Ohm
• Voltage - Supply: 10 V ~ 36 V, ±5 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Product: Class-D
• Output Power: 55 W
• Available Set Gain: 36 dB
• Common Mode Rejection Ratio (min): 75 dB
• Thd Plus Noise: 0.007 %
• Operating Supply Voltage: 22 V
• Supply Current: 145 mA
• Maximum Power Dissipation: 5000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Dual Supply Voltage: +/- 11 V
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single or Dual
• Supply Voltage (max): 36 V
• Supply Voltage (min): 10 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935283477112; TDA8932BT; TDA8932BT

NXP Semiconductors
10. Limiting values
11. Thermal characteristics
Table 9.
TDA8932B_4
Product data sheet
Symbol
SO32 package
R
th(j-a)
j-lead
j-top
Thermal characteristics
Parameter
thermal resistance from junction
to ambient
thermal characterization
parameter from junction to lead
thermal characterization
parameter from junction to top of
package
Table 8.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
Symbol Parameter
V
V
I
T
T
T
P
V
ORM
j
stg
amb
P
x
esd
V
Measured with respect to pin INREF; V
Measured with respect to pin V
Measured with respect to pin CGND; V
V
Current limiting concept.
Human Body Model (HBM); R
For pins 2, 3, 11, 14 and 15 V
Machine Model (MM); R
P
SS
= V
= V
DDP1
supply voltage
voltage on pin x
repetitive peak output
current
junction temperature
storage temperature
ambient temperature
power dissipation
electrostatic discharge
voltage
SSP1
Limiting values
IN1P, IN1N, IN2P, IN2N
OSCREF, OSCIO, TEST
POWERUP, ENGAGE,
DIAG
all other pins
= V
V
SSP1
SSP2
= V
Conditions
free air natural convection
; V
Rev. 04 — 18 December 2008
JEDEC test board
2 layer application board
DD
DDP2
s
= 0 ; C = 200 pF; L = 0.75 H.
= V
esd
DDP1
s
V
SSD(HW)
= 1500 ; C = 100 pF
SSP2
= 1800 V.
= V
.
; V
DDP2
x
x
Conditions
asymmetrical supply
maximum output
current limiting
HBM
MM
< V
< V
x
< V
.
DD
DD
DD
+ 0.3 V.
+ 0.3 V.
+ 0.3 V.
[1]
[2]
[3]
[4]
[1]
[2]
[3]
[5]
[6]
[7]
[8]
Min
-
-
-
-
Min
V
V
V
4
-
-
0.3
5
55
40
2000
200
SSD(HW)
CGND
SS
Class-D audio amplifier
0.3
Typ
41
44
-
-
TDA8932B
0.3
0.3 5
© NXP B.V. 2008. All rights reserved.
Max
+40
+5
6
V
-
150
+150
+85
5
+2000
+200
Max
44
-
30
8
DD
+ 0.3 V
16 of 48
Unit
K/W
K/W
K/W
K/W
Unit
V
V
V
V
A
W
V
V
C
C
C