AT32UC3A464S Atmel Corporation, AT32UC3A464S Datasheet - Page 228
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AT32UC3A464S
Manufacturer Part Number
AT32UC3A464S
Description
Manufacturer
Atmel Corporation
Datasheets
1.AT32UC3A0128.pdf
(377 pages)
2.AT32UC3A0128.pdf
(33 pages)
3.AT32UC3A0128.pdf
(159 pages)
4.AT32UC3A3128.pdf
(91 pages)
5.AT32UC3A3128.pdf
(1012 pages)
Specifications of AT32UC3A464S
Flash (kbytes)
64 Kbytes
Pin Count
100
Max. Operating Frequency
66 MHz
Cpu
32-bit AVR
Hardware Qtouch Acquisition
No
Usb Transceiver
1
Usb Speed
Hi-Speed
Usb Interface
Device + OTG
Spi
6
Twi (i2c)
2
Uart
4
Ssc
1
Sd / Emmc
2
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
8
Adc Resolution (bits)
10
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
AES
Sram (kbytes)
128
Self Program Memory
YES
Dram Memory
No
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
3.0 to 3.6
Operating Voltage (vcc)
3.0 to 3.6
Fpu
No
Mpu / Mmu
Yes / No
Timers
6
Output Compare Channels
6
Input Capture Channels
6
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT32UC3A464S-U
Manufacturer:
ATMEL
Quantity:
551
- AT32UC3A0128 PDF datasheet
- AT32UC3A0128 PDF datasheet #2
- AT32UC3A0128 PDF datasheet #3
- AT32UC3A3128 PDF datasheet #4
- AT32UC3A3128 PDF datasheet #5
- Current page: 228 of 1012
- Download datasheet (16Mb)
Figure 16-8. Self Refresh Mode Behavior
16.7.6.2
32072G–11/2011
SDRAMC_A[12:0]
SDCKE
SDWE
SDCK
SDCS
RAS
CAS
Low power mode
and Drive Strength (DS) parameters must be set by writing the corresponding fields in the LPR
register, and transmitted to the low power SDRAM device during initialization.
After initialization, as soon as the LPR.PASR, LPR.DS, or LPR.TCSR fields are modified and
self refresh mode is activated, the SDRAMC issues an Extended Load Mode Register command
to the SDRAM and the Extended Mode Register of the SDRAM device is accessed automati-
cally. The PASR/DS/TCSR parameters values are therefore updated before entry into self
refresh mode.
The SDRAM device must remain in self refresh mode for a minimum period of t
remain in self refresh mode for an indefinite period. This is described in
228.
This mode is selected by writing the value two to the LPR.LPCB field. Power consumption is
greater than in self refresh mode. All the input and output buffers of the SDRAM device are
deactivated except SDCKE, which remains low. In contrast to self refresh mode, the SDRAM
device cannot remain in low power mode longer than the refresh period (64 ms for a whole
device refresh operation). As no auto refresh operations are performed by the SDRAM itself, the
SDRAMC carries out the refresh operation. The exit procedure is faster than in self refresh
mode.
This is described in
Figure 16-9 on page
Self Refresh Mode
229.
To the SDRAM Controller
Access Request
T
XSR
Figure 16-8 on page
= 3
RAS
Row
and may
228
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