SAM3U4E Atmel Corporation, SAM3U4E Datasheet - Page 373
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SAM3U4E
Manufacturer Part Number
SAM3U4E
Description
Manufacturer
Atmel Corporation
Specifications of SAM3U4E
Flash (kbytes)
256 Kbytes
Pin Count
144
Max. Operating Frequency
96 MHz
Cpu
Cortex-M3
# Of Touch Channels
57
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
1
Quadrature Decoder Channels
1
Usb Speed
Hi-Speed
Usb Interface
Device
Spi
5
Twi (i2c)
2
Uart
5
Ssc
1
Sd / Emmc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
16
Adc Resolution (bits)
12
Adc Speed (ksps)
384
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
50
Self Program Memory
YES
External Bus Interface
1
Dram Memory
No
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
Yes / No
Timers
3
Output Compare Channels
3
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
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Figure 25-19. TDF Optimization: No TDF wait states are inserted if the TDF period is over when the next access begins
25.13.3
6430E–ATARM–29-Aug-11
6430E–ATARM–29-Aug-11
D[15:0]
A [23:2]
NCS0
NWE
MCK
NRD
TDF Optimization Disabled (TDF_MODE = 0)
read access on NCS0 (NRD controlled)
When optimization is disabled, tdf wait states are inserted at the end of the read transfer, so that
the data float period ends when the second access begins. If the hold period of the read1 con-
trolling signal overlaps the data float period, no additional tdf wait states will be inserted.
Figure
with no TDF optimization.
• read access followed by a read access on another chip select,
• read access followed by a write access on another chip select,
• read access followed by a write access on the same chip select,
25-20,
Figure 25-21
NRD_HOLD= 4
TDF_CYCLES = 6
and
Figure 25-22
Read to Write
Wait State
NWE_SETUP= 3
illustrate the cases:
write access on NCS0 (NWE controlled)
SAM3U Series
SAM3U Series
373
373
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