AD7811 Analog Devices, AD7811 Datasheet - Page 4

• Manufacturer Part Number: AD7811
• Description: 10-Bit, 4-Channel, 350 kSPS, Serial A/D Converter
• Manufacturer: Analog Devices

Specifications of AD7811

• Resolution (bits): 10bit
• # Chan: 4
• Sample Rate: 350kSPS
• Interface: Ser
• Analog Input Type: Diff-Uni,SE-Uni
• Ain Range: (Vref) p-p,Uni (Vref)
• Adc Architecture: SAR
• Pkg Type: DIP,SOIC,SOP

AD7811/AD7812
Model
AD7811YN
AD7811YR
AD7811YRU
AD7812YN
AD7812YR
AD7812YRU
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7811/AD7812 features proprietary ESD protection circuitry, permanent damage may occur
on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
V
Digital Input Voltage to DGND (CONVST, SCLK, RFS, TFS,
Digital Output Voltage to DGND (DOUT)
REF
Analog Inputs
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
DD
DIN, A0) . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
V
V
θ
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . . . 260°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
JA
IN1
IN1
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
IN
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 105°C/W
–V
–V
to AGND . . . . . . . . . . . . . . . . . . . –0.3 V, V
IN4
IN8
(AD7811) . . . . . . . . . . . . . . –0.3 V, V
(AD7812) . . . . . . . . . . . . . . –0.3 V, V
Linearity
Error
± 1 LSB
± 1 LSB
± 1 LSB
± 1 LSB
± 1 LSB
± 1 LSB
Package
Descriptions
16-Lead Plastic DIP
16-Lead Small Outline IC (SOIC)
16-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Plastic DIP
20-Lead Small Outline IC (SOIC)
20-Lead Thin Shrink Small Outline Package (TSSOP)
DD
DD
DD
DD
DD
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 450 mW
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
θ
Lead Temperature, Soldering
θ
Lead Temperature, Soldering
JA
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 115°C/W
WARNING!
ESD SENSITIVE DEVICE
Package
Options
N-16
R-16A
RU-16
N-20
R-20A
RU-20