SA58632 NXP Semiconductors, SA58632 Datasheet - Page 21

• Manufacturer Part Number: SA58632
• Manufacturer: NXP Semiconductors

NXP Semiconductors
15. Package outline
Fig 24. Package outline SOT910-1 (HVQFN20)
SA58632_2
Product data sheet
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 6 x 5 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included
UNIT
mm
SOT910-1
VERSION
OUTLINE
max
terminal 1
index area
terminal 1
index area
A
1
0.05
0.00
E
A
L
h
1
6
1
0.4
0.3
b
IEC
- - -
7
20
0.2
c
e
D
e
D
5.1
4.9
1
h
D
b
1/2 e
3.15
2.85
D
17
MO-220
JEDEC
h
10
REFERENCES
6.1
5.9
E
0
11
16
1/2 e
Rev. 02 — 4 March 2010
w
v
e
4.15
3.85
B A
E
M
M
h
e
E
2
C
C
JEITA
0.8
A
- - -
e
scale
B
2.5
2.4
e
1
A
A
1
e
4
2
5 mm
0.65
0.40
L
y
1
C
0.1
v
detail X
0.05
w
PROJECTION
EUROPEAN
2 × 2.2 W BTL audio amplifier
0.05
C
X
y
y
0.1
y
1
SA58632
© NXP B.V. 2010. All rights reserved.
c
ISSUE DATE
05-10-11
SOT910-1
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