RB751_SER NXP Semiconductors, RB751_SER Datasheet
RB751_SER
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RB751_SER Summary of contents
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RB751 series Schottky barrier single diodes Rev. 01 — 21 May 2007 1. Product profile 1.1 General description Planar Schottky barrier single diodes with an integrated guard ring for stress protection, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table ...
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... The marking bar indicates the cathode. 3. Ordering information Table 4. Type number RB751CS40 RB751S40 RB751V40 4. Marking Table 5. Type number RB751CS40 RB751S40 RB751V40 RB751_SER_1 Product data sheet Pinning Description cathode anode cathode anode Ordering information Package Name Description - leadless ultra small plastic package; 2 terminals; ...
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... Characteristics Table unless otherwise specified. amb Symbol [1] Pulse test: t RB751_SER_1 Product data sheet Limiting values Parameter Conditions repetitive peak reverse voltage reverse voltage forward current non-repetitive peak forward square wave; current t p total power dissipation ...
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... amb ( amb Fig 1. Forward current as a function of forward voltage; typical values MHz amb Fig 3. Diode capacitance as a function of reverse voltage; typical values RB751_SER_1 Product data sheet mlc361 ( A) 0.6 0 (V) F (1) T (2) T (3) T Fig 2. Reverse current as a function of reverse ...
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... Fig 6. Package outline SOD323 (SC-76) 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number RB751CS40 RB751S40 RB751V40 [1] For further information and the availability of packing methods, see RB751_SER_1 Product data sheet 0.50 0.46 1.65 1.02 1.55 0.95 03-04-17 Dimensions in mm Fig 5. Package outline SOD523 (SC-79) 1 ...
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... NXP Semiconductors 10. Soldering Fig 7. Reflow soldering footprint SOD882 Fig 8. Reflow soldering footprint SOD523 (SC-79) RB751_SER_1 Product data sheet 0.90 0.30 solder lands (2 ) 0.40 solder paste (2 ) 0.50 solder resist (2 ) occupied area Reflow soldering is the only recommended soldering method. Dimensions in mm 1.20 solder lands solder paste ...
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... NXP Semiconductors Fig 9. Reflow soldering footprint SOD323 (SC-76) Fig 10. Wave soldering footprint SOD323 (SC-76) RB751_SER_1 Product data sheet 3.05 2.80 2.10 1.60 1.65 0.95 0. Dimensions in mm 5.00 4.40 1.40 2.75 1.20 preferred transport direction during soldering Dimensions in mm Rev. 01 — 21 May 2007 RB751 series Schottky barrier single diodes solder lands solder resist 0.50 0.60 occupied area ...
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... NXP Semiconductors 11. Revision history Table 10. Revision history Document ID Release date RB751_SER_1 20070521 RB751_SER_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 21 May 2007 RB751 series Schottky barrier single diodes Supersedes - © NXP B.V. 2007. All rights reserved. ...
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... Contact information For additional information, please visit: For sales office addresses, send an email to: RB751_SER_1 Product data sheet [3] Definition This document contains data from the objective specification for product development. ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 21 May 2007 Document identifier: RB751_SER_1 ...