RB751_SER NXP Semiconductors, RB751_SER Datasheet - Page 6

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RB751_SER

Manufacturer Part Number
RB751_SER
Description
Planar Schottky barrier single diodes with an integrated guard ring for stress protection,encapsulated in small Surface-Mounted Device (SMD) plastic packages
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
10. Soldering
RB751_SER_1
Product data sheet
Fig 7. Reflow soldering footprint SOD882
Fig 8. Reflow soldering footprint SOD523 (SC-79)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
R = 0.05 (8 )
solder lands
solder resist
occupied area
solder paste
0.90
solder lands
solder resist
solder paste
occupied area
Rev. 01 — 21 May 2007
0.30
0.40
0.50
(2 )
(2 )
(2 )
1.20
0.30
1.30
1.80
1.90
2.15
0.30
0.40
Schottky barrier single diodes
RB751 series
R = 0.05 (8 )
0.60
(2 )
0.50
mgs343
0.60
0.70
(2 )
© NXP B.V. 2007. All rights reserved.
mbl872
0.80
(2 )
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