BAS32L NXP Semiconductors, BAS32L Datasheet - Page 7

Single high-speed switching diode, fabricated in planar technology, and encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package

BAS32L

Manufacturer Part Number
BAS32L
Description
Single high-speed switching diode, fabricated in planar technology, and encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS32L

Dc
N/A

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NXP Semiconductors
11. Soldering
BAS32L
Product data sheet
Fig 9.
Fig 10. Wave soldering footprint SOD80C
2.90
Reflow soldering footprint SOD80C
1.70
2.25
1.70
All information provided in this document is subject to legal disclaimers.
1.60
Rev. 7 — 20 January 2011
0.90
(2x)
6.30
4.90
2.70
1.90
4.55
4.30
2.30
sod080c
sod080c
High-speed switching diode
Dimensions in mm
solder lands
solder resist
occupied area
Dimensions in mm
solder paste
© NXP B.V. 2011. All rights reserved.
BAS32L
solder lands
solder resist
occupied area
tracks
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