LPC12D27FBD100 NXP Semiconductors, LPC12D27FBD100 Datasheet - Page 18

• Manufacturer Part Number: LPC12D27FBD100
• Description: The LPC12D27FBD100 is a ARM Cortex-M0 based microcontroller for embedded applications featuring a high level of integration and low power consumption
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Thermal characteristics
Table 6.
V
LPC12D27
Product data sheet
Symbol
R
R
T
DD
j(max)
th(j-a)
th(j-c)
= 3.0 V to 3.6 V; T
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to case
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
j
•
•
•
=

T
R
P
40
amb
T
D
th(j-a)
amb

= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)

P
D
All information provided in this document is subject to legal disclaimers.

Conditions
JEDEC test board; no
air flow
JEDEC test board

C unless otherwise specified.
R
LQFP64 package
LQFP48 package
LQFP64 package
LQFP48 package
th j a
Rev. 1 — 20 September 2011

–


j
(C), can be calculated using the following
Min
-
-
-
DD
32-bit ARM Cortex-M0 microcontroller
and V
DD
Typ
61
86
19
36
-
. The I/O power dissipation of
LPC12D27
Max
-
-
-
-
150
© NXP B.V. 2011. All rights reserved.
Unit
C/W
C/W
C/W
C/W
C
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