LPC12D27FBD100 NXP Semiconductors, LPC12D27FBD100 Datasheet - Page 41

• Manufacturer Part Number: LPC12D27FBD100
• Description: The LPC12D27FBD100 is a ARM Cortex-M0 based microcontroller for embedded applications featuring a high level of integration and low power consumption
• Manufacturer: NXP Semiconductors

NXP Semiconductors
14. Soldering
LPC12D27
Product data sheet
Fig 25. Reflow soldering of the LQFP100 package
Footprint information for reflow soldering of LQFP100 package
DIMENSIONS in mm
0.500
P1
0.560
P2
17.300 17.300 14.300 14.300
Hy
Ax
solder land
occupied area
Gy
Ay
C
Bx
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
Rev. 1 — 20 September 2011
0.280
Generic footprint pattern
D1
0.400 14.500 14.500 17.550 17.550
P1
D2
Hx
Gx
Bx
Ax
Gx
(0.125)
Gy
32-bit ARM Cortex-M0 microcontroller
Hx
D1
Hy
By
LPC12D27
© NXP B.V. 2011. All rights reserved.
Ay
SOT407-1
sot407-1
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