STM8TL53G4 STMicroelectronics, STM8TL53G4 Datasheet - Page 54

• Manufacturer Part Number: STM8TL53G4
• Description: 8-bit, ultra-low-power, touch-sensing MCUs with 16-Kbyte Flash and proximity detection
• Manufacturer: STMicroelectronics

Specifications of STM8TL53G4

• Operating Power Supply: 1.65 V to 3.6 V
• Temperature Range: –40 °C to 85 °C
• 4 Low Power Modes: Wait, Active-halt with AWU (1 μA), Active-halt with ProxSense™ (10 μA with scan every 200 ms),Halt (0.4 μA)
• Dynamic Power Consumption: 150 μA/MHz
• Fast Wakeup From Halt Mode: 4.7 μs
• Ultralow Leakage Per I/o: 50 nA

Package characteristics
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Package characteristics
ECOPACK
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
an ST trademark.
Package mechanical data
Figure 17. UFQFPN48 - 48-lead ultra thin fine pitch quad flat no-lead package
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
®
packages, depending on their level of environmental compliance. ECOPACK
outline (7x7)
®
Doc ID 022344 Rev 1
STM8TL53xx
®
is