74LVC07ABQ,115 NXP Semiconductors, 74LVC07ABQ,115 Datasheet - Page 3

IC BUFF HEX OPEN DRAIN 14DHVQFN

74LVC07ABQ,115

Manufacturer Part Number
74LVC07ABQ,115
Description
IC BUFF HEX OPEN DRAIN 14DHVQFN
Manufacturer
NXP Semiconductors
Series
74LVCr
Datasheet

Specifications of 74LVC07ABQ,115

Package / Case
14-VQFN Exposed Pad, 14-HVQFN, 14-SQFN, 14-DHVQFN
Logic Type
Buffer/Line Driver, Non-Inverting with Open Drain
Number Of Elements
6
Number Of Bits Per Element
1
Current - Output High, Low
32mA, 32mA
Voltage - Supply
2 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
LVC
Number Of Channels Per Chip
6
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.65 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Input Bias Current (max)
10 uA
Low Level Output Current
32 mA
Minimum Operating Temperature
- 40 C
Output Type
Open Drain
Propagation Delay Time
2.4 ns (Typ) @ 2.7 V or 2.2 ns (Typ) @ 3.3 V or 1.6 ns (Typ) @ 5 V
Package
14DHVQFN EP
Logic Function
Buffer/Driver
Number Of Outputs Per Chip
6
Input Signal Type
Single-Ended
Maximum Propagation Delay Time @ Maximum Cl
2.4(Typ)@2.7V|2.2(Typ)@3.3V|1.6(Typ)@5V ns
Tolerant I/os
5 V
Typical Quiescent Current
0.1 uA
Number Of Lines (input / Output)
6 / 6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-2992-2
935273332115

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74LVC07ABQ,115
Manufacturer:
NXP Semiconductors
Quantity:
7 200
Philips Semiconductors
ORDERING INFORMATION
PINNING
2003 Nov 11
handbook, halfpage
74LVC07AD
74LVC07APW
74LVC07ABQ
Hex buffer with open-drain outputs
Fig.1 Pin configuration SO14 and TSSOP14.
TYPE NUMBER
PIN
10
11
12
13
14
1
2
3
4
5
6
7
8
9
GND
1A
1Y
2A
2Y
3A
3Y
1
2
3
4
5
6
7
07
MNA531
1A
1Y
2A
2Y
3A
3Y
GND
4Y
4A
5Y
5A
6Y
6A
V
TEMPERATURE RANGE
CC
14
13
12
11
10
9
8
40 to +125 C
40 to +125 C
40 to +125 C
V CC
6A
6Y
5A
5Y
4A
4Y
SYMBOL
3
data input
data output
data input
data output
data input
data output
ground (0 V)
data output
data input
data output
data input
data output
data input
supply voltage
handbook, halfpage
PINS
(1) The die substrate is attached to this pad using conductive die
14
14
14
attach material. It can not be used as a supply pin or input.
PACKAGE
Fig.2 Pin configuration DHVQFN14.
1Y
2A
2Y
3A
3Y
DHVQFN14
PACKAGE
Top view
TSSOP14
2
3
4
5
6
SO14
DESCRIPTION
GND
1A
7
1
GND
V CC
MATERIAL
(1)
4Y
14
8
plastic
plastic
plastic
Product specification
MBL760
74LVC07A
13
12
11
10
9
6A
6Y
5A
5Y
4A
SOT108-1
SOT402-1
SOT762-1
CODE

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