74LVC827ADB,112 NXP Semiconductors, 74LVC827ADB,112 Datasheet - Page 14

IC BUFF DVR TRI-ST 10BIT 24SSOP

74LVC827ADB,112

Manufacturer Part Number
74LVC827ADB,112
Description
IC BUFF DVR TRI-ST 10BIT 24SSOP
Manufacturer
NXP Semiconductors
Series
74LVCr
Datasheet

Specifications of 74LVC827ADB,112

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
10
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
24-SSOP
Logic Family
LVC
Number Of Channels Per Chip
10
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 24 mA
Low Level Output Current
24 mA
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
10 / 10
Output Type
3-State
Propagation Delay Time
10 ns at 1.2 V, 2.8 ns at 3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
74LVC827ADB
74LVC827ADB
935262419112
Philips Semiconductors
Fig 10. Package outline TSSOP24.
9397 750 13037
Product data sheet
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT355-1
max.
1.1
A
24
1
0.15
0.05
A
Z
1
y
pin 1 index
0.95
0.80
A
2
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
REFERENCES
D
10-bit buffer/line driver with 5 V tolerant inputs/outputs; 3-state
b
7.9
7.7
0
(1)
p
Rev. 02 — 8 April 2004
13
12
E
4.5
4.3
w
(2)
M
JEITA
scale
0.65
2.5
e
c
H
6.6
6.2
E
A
2
5 mm
A
L
1
1
0.75
0.50
L
p
H
E
E
0.4
0.3
detail X
Q
PROJECTION
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
L
EUROPEAN
0.2
L
v
p
Q
0.13
74LVC827A
w
A
(A )
3
0.1
X
y
v
A
ISSUE DATE
M
99-12-27
03-02-19
0.5
0.2
A
Z
(1)
SOT355-1
8
0
o
o
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