PHB10N40 NXP Semiconductors, PHB10N40 Datasheet
PHB10N40
Related parts for PHB10N40
PHB10N40 Summary of contents
Page 1
... ˚ > 25 ˚ starting T = 25˚ starting T = 25˚ CONDITIONS pcb mounted, minimum footprint 1 Product specification PHB10N40 MAX. UNIT 400 10.7 147 0.55 SYMBOL MIN. MAX. UNIT - 10 147 - 1.176 W ...
Page 2
... Measured from source lead solder point to source bond pad MHz GS DS CONDITIONS T = 25˚ 25˚ dI/dt = 100 Product specification PHB10N40 MIN. TYP. MAX. UNIT 400 - - V - 0.4 - V/K - 0.42 0.55 2.0 3.0 4.0 V 3.5 6 ...
Page 3
... V GS RDS(on), Drain-Source on resistance (Ohms) BUK457-400B 1 0 100 100 ms 0.2 0 1000 ˚ Product specification PHB10N40 Zth j-mb / (K/W) BUKx57- 0.5 0.2 0.1 0.05 0. 1E-05 1E-03 1E- Fig.4. Transient thermal impedance f(t); parameter j-mb ...
Page 4
... 1E-04 1E-05 1E- 10000 1000 100 10 80 100 120 140 Fig.12. Typical capacitances f Product specification PHB10N40 VGS(TO max. typ. min. -40 - 100 120 140 Fig.10. Gate threshold voltage . = f(T ); conditions 0.25 mA SUB-THRESHOLD CONDUCTION ...
Page 5
... Fig.17. Normalised unclamped inductive energy VGS 0 100 150 Fig.18. Unclamped inductive test circuit Product specification PHB10N40 PHP10N40 VGS = 0 V 150 0.2 0.4 0.6 0.8 1 1.2 VSDS, Source-Drain voltage (Volts f(V ); parameter T F SDS j EAS, Normalised unclamped inductive energy (%) ...
Page 6
... Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Epoxy meets UL94 V0 at 1/8". April 1997 10.3 max 11 max 15.4 0.85 max (x2) Fig.19. SOT404 : centre pin connected to mounting base. 11.5 9.0 2.0 3.8 5.08 Fig.20. SOT404 : soldering pattern for surface mounting . 6 Product specification PHB10N40 4.5 max 1.4 max 2.5 0.5 17.5 Rev 1.000 ...
Page 7
... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. April 1997 7 Product specification PHB10N40 Rev 1.000 ...