OM6213 NXP Semiconductors, OM6213 Datasheet - Page 2
OM6213
Manufacturer Part Number
OM6213
Description
Om6213 48 X 84 Pixels Matrix Lcd Driver
Manufacturer
NXP Semiconductors
Datasheet
1.OM6213.pdf
(40 pages)
Philips Semiconductors
CONTENTS
1
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
9
10
10.1
11
11.1
11.2
2001 Nov 07
48
84 pixels matrix LCD driver
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
PIN FUNCTIONS
ROW 0 to ROW 47 row driver outputs
COL 0 to COL 83 column driver outputs
V
V
V
supplies
V
T1 to T7: test pads
SDIN: serial data line
SCLK: serial clock line
D/C: mode select
SCE: chip enable
OSC: oscillator
RES: reset
BLOCK DIAGRAM FUNCTIONS
Oscillator
Address counter (AC)
Display Data RAM (DDRAM)
Timing generator
Display address counter
LCD row and column drivers
V
INITIALIZATION
ADDRESSING
Data structure
INSTRUCTIONS
Reset function
Function set
SS1
DD1
LCDOUT,
OS0
LCD
and V
to V
to V
generator
OS4
DD3
V
LCDIN
SS2
: positive power supply rails
: negative power supply rails
and V
LCDSENSE
: LCD power
2
11.2.1
11.2.2
11.2.3
11.3
11.3.1
11.4
11.5
11.6
11.7
11.8
12
13
14
15
16
17
18
19
20
20.1
20.2
20.3
20.4
20.5
20.6
20.7
21
22
23
24
25
26
PD
V
H
Display Control
D, E
Set Y address of RAM
Set X address of RAM
Temperature Control
Bias value:
V
TEMPERATURE COMPENSATION
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
AC CHARACTERISTICS
SERIAL INTERFACE
RESET
APPLICATION INFORMATION
MODULE MAKER PROGRAMMING
V
Charge pump multiplication factor
Bias system selected when BS[2:0] = 100
V
TC[1:0] = 01 (TC1)
Seal bit
Module Maker parameter programming
Example of V
CHIP INFORMATION
BONDING PAD LOCATIONS
DEVICE PROTECTION DIAGRAM
TRAY INFORMATION
DEFINITIONS
LIFE SUPPORT APPLICATIONS
LCD
LCD
LCD
generator
calibration
temperature coefficient selected when
LCD
calibration flow
Product specification
OM6213